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- Hooman MohseniNorthwestern UniversityEmail verificata su northwestern.edu
- Omer G MemisIntel CorporationEmail verificata su intel.com
- Dibyendu DeyEngineer at Microsoft CorporationEmail verificata su intel.com
- Daniela R. RaduMECHANICAL AND MATERIALS ENGINEERINGEmail verificata su fiu.edu
- Alok TayiPostdoctoral Fellow, Harvard UniversityEmail verificata su fas.harvard.edu
- Kang L. WangElectrical Engineering DepartmentEmail verificata su ee.ucla.edu
- Alireza BonakdarNorthwestern UniversityEmail verificata su u.northwestern.edu
- Ryan GelfandCREOL, UCFEmail verificata su u.northwestern.edu
- John KohoutekIndustryEmail verificata su u.northwestern.edu
- Zhiqiang Fang (方志强)South China University of Technology,State Key Laboratory of Pulping and Paper EngineeringEmail verificata su scut.edu.cn
- Hongli ZhuAssociate Professor, College of Enginnering Faculty Fellow, Northeastern UniversityEmail verificata su neu.edu
- Liangbing HuUniversity of Maryland College ParkEmail verificata su umd.edu
- Katherine E RoelofsIntel, DuPont, Stanford UniversityEmail verificata su stanford.edu
- Jeffrey MethDuPontEmail verificata su dupont.com
- Iman Hassani niaNorthwestern UniversityEmail verificata su u.northwestern.edu