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Shiv Govind Singh
Shiv Govind Singh
Professor, Electrical Engineering, IITHyderabad
Geverifieerd e-mailadres voor ee.iith.ac.in
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Cu–Cu diffusion bonding enhancement at low temperature by surface passivation using self-assembled monolayer of alkane-thiol
CS Tan, DF Lim, SG Singh, SK Goulet, M Bergkvist
Applied Physics Letters 95 (19), 2009
1742009
Recent advances in biosensors for diagnosis and detection of sepsis: A comprehensive review
S Kumar, S Tripathy, A Jyoti, SG Singh
Biosensors and Bioelectronics 124, 205-215, 2019
1502019
Convective heat transfer in diverging and converging microchannels
VS Duryodhan, A Singh, SG Singh, A Agrawal
International Journal of Heat and Mass Transfer 80, 424-438, 2015
1302015
Chemiresistive Sensor Based on Zinc Oxide Nanoflakes for CO2 Detection
S Kanaparthi, SG Singh
ACS Applied Nano Materials 2 (2), 700-706, 2019
1072019
Impact of aspect ratio on flow boiling of water in rectangular microchannels
SG Singh, A Kulkarni, SP Duttagupta, BP Puranik, A Agrawal
Experimental Thermal and Fluid Science 33 (1), 153-160, 2008
1052008
One step biofunctionalized electrospun multiwalled carbon nanotubes embedded zinc oxide nanowire interface for highly sensitive detection of carcinoma antigen-125
KB Paul, V Singh, SRK Vanjari, SG Singh
Biosensors and Bioelectronics 88, 144-152, 2017
1002017
Electrospun manganese (III) oxide nanofiber based electrochemical DNA-nanobiosensor for zeptomolar detection of dengue consensus primer
S Tripathy, SRK Vanjari, V Singh, S Swaminathan, SG Singh
Biosensors and Bioelectronics 90, 378-387, 2017
962017
Highly sensitive and ultra-fast responsive ammonia gas sensor based on 2D ZnO nanoflakes
S Kanaparthi, SG Singh
Materials Science for Energy Technologies 3, 91-96, 2020
912020
A highly sensitive self assembled monolayer modified copper doped zinc oxide nanofiber interface for detection of Plasmodium falciparum histidine-rich protein-2 …
KB Paul, S Kumar, S Tripathy, SRK Vanjari, V Singh, SG Singh
Biosensors and Bioelectronics 80, 39-46, 2016
812016
Blood plasma separation in elevated dimension T-shaped microchannel
S Tripathi, A Prabhakar, N Kumar, SG Singh, A Agrawal
Biomedical microdevices 15, 415-425, 2013
782013
Label-Free Electrochemical Detection of DNA Hybridization: A Method for COVID-19 Diagnosis
S Tripathy, SG Singh
Transactions of the Indian National Academy of Engineering, 1, 2020
712020
Electrospun CNT embedded ZnO nanofiber based biosensor for electrochemical detection of Atrazine: a step closure to single molecule detection
P Supraja, V Singh, SRK Vanjari, S Govind Singh
Microsystems & nanoengineering 6 (1), 3, 2020
612020
Improved performance of a single chamber microbial fuel cell using nitrogen-doped polymer-metal-carbon nanocomposite-based air-cathode
A Modi, S Singh, N Verma
International Journal of Hydrogen Energy 42 (5), 3271-3280, 2017
612017
A multi-walled carbon nanotube–zinc oxide nanofiber based flexible chemiresistive biosensor for malaria biomarker detection
AK Panigrahi, V Singh, SG Singh
Analyst 142 (12), 2128-2135, 2017
582017
Liquid flow through a diverging microchannel
VS Duryodhan, SG Singh, A Agrawal
Microfluidics and nanofluidics 14, 53-67, 2013
582013
Recent advancement of carbon nanomaterials engrained molecular imprinted polymer for environmental matrix
M Singh, S Singh, SP Singh, SS Patel
Trends in Environmental Analytical Chemistry 27, e00092, 2020
562020
Electrospun tin (IV) oxide nanofiber based electrochemical sensor for ultra-sensitive and selective detection of atrazine in water at trace levels
P Supraja, S Tripathy, SRK Vanjari, V Singh, SG Singh
Biosensors and Bioelectronics 141, 111441, 2019
522019
Label free, electrochemical detection of atrazine using electrospun Mn2O3 nanofibers: Towards ultrasensitive small molecule detection
P Supraja, S Tripathy, SRK Vanjari, V Singh, SG Singh
Sensors and Actuators B: Chemical 285, 317-325, 2019
522019
Ultra-thin Ti passivation mediated breakthrough in high quality Cu-Cu bonding at low temperature and pressure
AK Panigrahi, S Bonam, T Ghosh, SG Singh, SRK Vanjari
Materials Letters 169, 269-272, 2016
522016
Thermal mitigation using thermal through silicon via (TTSV) in 3-D ICs
SG Singh, CS Tan
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009 …, 2009
522009
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Artikelen 1–20