6b9b encoding scheme for improving single-ended interface bandwidth and reducing power consumption without pin count increase B Wang, M Wang, WH Ryu 2007 IEEE Electrical Performance of Electronic Packaging, 25-28, 2007 | 64 | 2007 |
Effects of on-chip and off-chip decoupling capacitors on electromagnetic radiated emission J Kim, H Kim, W Ryu, J Kim, YH Yun, SH Kim, SH Ham, HK An, YH Lee 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat …, 1998 | 57 | 1998 |
An efficient crosstalk parameter extraction method for high-speed interconnection lines M Sung, W Ryu, H Kim, J Kim, J Kim IEEE Transactions on advanced packaging 23 (2), 148-155, 2000 | 51 | 2000 |
Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications MJ Yim, W Ryu, YD Jeon, J Lee, S Ahn, J Kim, KW Paik IEEE Transactions on Components and Packaging Technologies 22 (4), 575-581, 1999 | 51 | 1999 |
High-Frequency Simultaneous Switching Output Noise (SSO) Simulation Methodology for a DDR333/400 Data Interface WH Ryu, H Fahmy, H Maramis Jun 27, 1-6, 2002 | 47 | 2002 |
Separated role of on-chip and on-PCB decoupling capacitors for reduction of radiated emission on printed circuit board JH Kim, B Choi, H Kim, W Ryu, Y Yun, S Ham, SH Kim, Y Lee, J Kim 2001 IEEE EMC International Symposium. Symposium Record. International …, 2001 | 35 | 2001 |
RF interconnect for multi-Gbit/s board-level clock distribution W Ryu, J Lee, H Kim, S Ahn, N Kim, B Choi, D Kam, J Kim IEEE transactions on advanced packaging 23 (3), 398-407, 2000 | 35 | 2000 |
Power integrity for I/O interfaces: with signal integrity/power integrity co-design VS Pandit, WH Ryu, MJ Choi Pearson Education, 2010 | 34 | 2010 |
Embedded microstrip interconnection lines for gigahertz digital circuits W Ryu, SH Baik, H Kim, J Kim, M Sung, J Kim IEEE transactions on advanced packaging 23 (3), 495-503, 2000 | 31 | 2000 |
Reduction of crosstalk noise in modular jack for high-speed differential signal interconnection N Kim, M Sung, H Kim, S Baek, W Ryu, JG An, J Kim IEEE transactions on advanced packaging 24 (3), 260-267, 2001 | 30 | 2001 |
Electrical and thermal modelling of QFN packages ACW Lu, DJ Xie, ZF Shi, W Ryu Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000 …, 2000 | 30 | 2000 |
Over GHz low-power RF clock distribution for a multiprocessor digital system W Ryu, ALC Wai, F Wei, WL Lai, J Kim IEEE Transactions on advanced packaging 25 (1), 18-27, 2002 | 23 | 2002 |
High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm W Ryu, MJ Yim, S Ahn, J Lee, W Kim, KW Paik, J Kim IEEE Transactions on Components and Packaging Technologies 23 (3), 542-545, 2000 | 21 | 2000 |
A co-design methodology of signal integrity and power integrity WH Ryu Proc. of DesignCon 2006, 2006 | 18 | 2006 |
Over 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls S Ahn, W Ryu, MJ Yim, J Lee, YD Jeon, W Kim, KW Paik, J Kim Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology …, 1999 | 13 | 1999 |
Controllable parameters identification for high speed channel through signal-power integrity combined analysis MJ Choi, VS Pandit, WH Ryu 2008 58th Electronic Components and Technology Conference, 658-663, 2008 | 10 | 2008 |
High speed memory interface HM Fahmy, WH Ryu US Patent 7,106,610, 2006 | 10 | 2006 |
Voltage plane with high impedance link WH Ryu, HM Fahmy US Patent 6,822,526, 2004 | 10 | 2004 |
Microwave frequency interconnection line model of a wafer level package J Lee, W Ryu, J Kim, J Lee, N Kim, J Pak, JM Kim, J Kim IEEE transactions on advanced packaging 25 (3), 356-364, 2002 | 9 | 2002 |
High-frequency electrical performance of a new high-density multiple line grid array (MLGA) package S Ahn, JW Lee, J Kim, W Ryu, YS Kim, CK Yoon, J Kim 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat …, 2000 | 8 | 2000 |