Wide-band E-shaped patch antennas for wireless communications F Yang, XX Zhang, X Ye, Y Rahmat-Samii
IEEE transactions on antennas and propagation 49 (7), 1094-1100, 2001
1319 2001 Signal integrity design for high-speed digital circuits: Progress and directions J Fan, X Ye, J Kim, B Archambeault, A Orlandi
IEEE Transactions on Electromagnetic Compatibility 52 (2), 392-400, 2010
300 2010 Crosstalk cancellation and/or reduction X Ye
US Patent 9,293,798, 2016
150 2016 Impact of copper surface texture on loss: A model that works PG Huray, O Oluwafemi, J Loyer, E Bogatin, X Ye
DesignCon 2010 1, 462-483, 2010
117 2010 EMI mitigation with multilayer power-bus stacks and via stitching of reference planes X Ye, DA Hockanson, M Li, Y Ren, W Cui, JL Drewniak, RE DuBroff
IEEE Transactions on electromagnetic compatibility 43 (4), 538-548, 2001
107 2001 DC power-bus design using FDTD modeling with dispersive media and surface mount technology components X Ye, MY Koledintseva, M Li, JL Drewniak
IEEE Transactions on Electromagnetic Compatibility 43 (4), 579-587, 2001
88 2001 FDTD and experimental investigation of EMI from stacked-card PCB configurations DM Hockanson, X Ye, JL Drewniak, TH Hubing, TP Van Doren, ...
IEEE transactions on electromagnetic compatibility 43 (1), 1-10, 2001
55 2001 EMI resulting from signal via transitions through the DC power bus W Cui, X Ye, B Archambeault, D White, M Li, JL Drewniak
IEEE International Symposium on Electromagnetic Compatibility. Symposium …, 2000
48 2000 A novel de-embedding method suitable for transmission-line measurement B Chen, X Ye, B Samaras, J Fan
2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), 1-4, 2015
42 2015 Skew compensation by changing ground parasitic for traces C Ye, X Ye
US Patent 7,450,396, 2008
42 2008 Methods for minimizing the impedance discontinuity between a conductive trace and a component and structures formed thereby X Ye, D Miller, JD Bolen
US Patent 7,034,544, 2006
38 2006 Analytical and numerical sensitivity analyses of fixtures de-embedding B Chen, M Tsiklauri, C Wu, S Jin, J Fan, X Ye, B Samaras
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016
36 2016 Comparison of TRL calibration vs. 2x thru de-embedding methods SJ Moon, X Ye, R Smith
2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity …, 2015
34 2015 Improved “Root-Omega” method for transmission-line-based material property extraction for multilayer PCBs S Jin, B Chen, X Fang, H Gao, X Ye, J Fan
IEEE Transactions on Electromagnetic Compatibility 59 (4), 1356-1367, 2017
33 2017 De-embedding errors due to inaccurate test fixture characterization X Ye
IEEE Electromagnetic Compatibility Magazine 1 (4), 75-78, 2012
33 2012 Incorporating two-port networks with S-parameters into FDTD X Ye, JL Drewniak
IEEE microwave and wireless components letters 11 (2), 77-79, 2001
32 2001 Thru-reflect-line calibration technique: Error analysis for characteristic impedance variations in the line standards L Ye, C Li, X Sun, S Jin, B Chen, X Ye, J Fan
IEEE Transactions on Electromagnetic Compatibility 59 (3), 779-788, 2016
31 2016 Multi-Ports ([ ) 2×-Thru De-Embedding: Theory, Validation, and Mode Conversion Characterization B Chen, J He, Y Guo, S Pan, X Ye, J Fan
IEEE Transactions on Electromagnetic Compatibility 61 (4), 1261-1270, 2019
30 2019 Validating the transmission-line based material property extraction procedure including surface roughness for multilayer PCBs using simulations S Jin, X Fang, B Chen, H Gao, X Ye, J Fan
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016
30 2016 High-performance inter-PCB connectors: Analysis of EMI characteristics X Ye, JL Drewniak, J Nadolny, DM Hockanson
IEEE transactions on electromagnetic compatibility 44 (1), 165-174, 2002
30 2002