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Priyal H Shah
Priyal H Shah
AMD, Inc. (current), UC Berkeley (former), Virginia Tech (former), IIT Kharagpur (former)
Email verificata su vt.edu
Titolo
Citata da
Citata da
Anno
Optimal cure cycle parameters for minimizing residual stresses in fiber-reinforced polymer composite laminates
PH Shah, VA Halls, JQ Zheng, RC Batra
Journal of Composite Materials 52 (6), 773-792, 2017
452017
Elastic moduli of covalently functionalized single layer graphene sheets
PH Shah, RC Batra
Computational materials science 95, 637-650, 2014
222014
Active control of laminated composite truncated conical shells using vertically and obliquely reinforced 1-3 piezoelectric composites
PH Shah, MC Ray
European Journal of Mechanics-A/Solids 32, 1-12, 2012
162012
Effect of covalent functionalization on Young’s modulus of a single-wall carbon nanotube
PH Shah, RC Batra
Modeling of carbon nanotubes, graphene and their composites, 111-134, 2014
152014
Stress singularities and transverse stresses near edges of doubly curved laminated shells using TSNDT and stress recovery scheme
PH Shah, RC Batra
European Journal of Mechanics-A/Solids 63, 68-83, 2016
142016
Stretching and bending deformations due to normal and shear tractions of doubly curved shells using third-order shear and normal deformable theory
PH Shah, RC Batra
Mechanics of Advanced Materials and Structures 25 (15-16), 1276-1296, 2018
132018
In-plane elastic moduli of covalently functionalized single-wall carbon nanotubes
PH Shah, RC Batra
Computational Materials Science 83, 349–361, 2014
132014
Through-the-Thickness Stress Distributions near Edges of Composite Laminates using Stress Recovery Scheme and Third Order Shear and Normal Deformable Theory
PH Shah, RC Batra
Composite Structures 131, 397-413, 2015
122015
Stacking sequence optimization for maximizing the first failure initiation load followed by progressive failure analysis until the ultimate load
U Taetragool, PH Shah, VA Halls, JQ Zheng, RC Batra
Composite Structures 180, 1007-1021, 2017
102017
Active structural-acoustic control of laminated composite truncated conical shells using smart damping treatment
PH Shah, MC Ray
Journal of Vibration and Acoustics 135 (2), 2013
72013
Effect of Reissner’s Parameter on Strain Energies of Spherical Sandwich Shells
PH Shah, RC Batra
AIAA journal 57 (11), 4942-4952, 2019
42019
Bond pads for low temperature hybrid bonding
P Shah, MS Bhagavat
US Patent 10,937,755, 2021
12021
Fan-out package with reinforcing rivets
R Agarwal, MS Bhagavat, P Shah, CH Cheng, BP Wilkerson, L Fu
US Patent App. 16/544,021, 2021
12021
Optimal Lid Design Parameters for Reducing Warpage of Flip-chip Package
P Shah, M Bhagavat
International Symposium on Microelectronics 2019 (1), 000110-000114, 2019
12019
Molded semiconductor chip package with stair-step molding layer
P Shah, R Agarwal, MS Bhagavat, CH Cheng
US Patent App. 16/822,353, 2021
2021
Semiconductor chip with reduced pitch conductive pillars
P Shah, MS Bhagavat, L Fu
US Patent App. 17/195,046, 2021
2021
Bond pads for low temperature hybrid bonding
P Shah, MS Bhagavat
US Patent App. 17/189,324, 2021
2021
Semiconductor chip with reduced pitch conductive pillars
P Shah, MS Bhagavat, L Fu
US Patent 10,943,880, 2021
2021
Molded chip package with anchor structures
P Shah, MS Bhagavat, BP Wilkerson, L Fu, R Agarwal
US Patent App. 16/513,450, 2021
2021
Fan-out package with multi-layer redistribution layer structure
R Agarwal, MS Bhagavat, P Shah
US Patent 10,593,620, 2020
2020
Il sistema al momento non pu eseguire l'operazione. Riprova pi tardi.
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