| Optimal cure cycle parameters for minimizing residual stresses in fiber-reinforced polymer composite laminates PH Shah, VA Halls, JQ Zheng, RC Batra Journal of Composite Materials 52 (6), 773-792, 2017 | 45 | 2017 |
| Elastic moduli of covalently functionalized single layer graphene sheets PH Shah, RC Batra Computational materials science 95, 637-650, 2014 | 22 | 2014 |
| Active control of laminated composite truncated conical shells using vertically and obliquely reinforced 1-3 piezoelectric composites PH Shah, MC Ray European Journal of Mechanics-A/Solids 32, 1-12, 2012 | 16 | 2012 |
| Effect of covalent functionalization on Young’s modulus of a single-wall carbon nanotube PH Shah, RC Batra Modeling of carbon nanotubes, graphene and their composites, 111-134, 2014 | 15 | 2014 |
| Stress singularities and transverse stresses near edges of doubly curved laminated shells using TSNDT and stress recovery scheme PH Shah, RC Batra European Journal of Mechanics-A/Solids 63, 68-83, 2016 | 14 | 2016 |
| Stretching and bending deformations due to normal and shear tractions of doubly curved shells using third-order shear and normal deformable theory PH Shah, RC Batra Mechanics of Advanced Materials and Structures 25 (15-16), 1276-1296, 2018 | 13 | 2018 |
| In-plane elastic moduli of covalently functionalized single-wall carbon nanotubes PH Shah, RC Batra Computational Materials Science 83, 349–361, 2014 | 13 | 2014 |
| Through-the-Thickness Stress Distributions near Edges of Composite Laminates using Stress Recovery Scheme and Third Order Shear and Normal Deformable Theory PH Shah, RC Batra Composite Structures 131, 397-413, 2015 | 12 | 2015 |
| Stacking sequence optimization for maximizing the first failure initiation load followed by progressive failure analysis until the ultimate load U Taetragool, PH Shah, VA Halls, JQ Zheng, RC Batra Composite Structures 180, 1007-1021, 2017 | 10 | 2017 |
| Active structural-acoustic control of laminated composite truncated conical shells using smart damping treatment PH Shah, MC Ray Journal of Vibration and Acoustics 135 (2), 2013 | 7 | 2013 |
| Effect of Reissner’s Parameter on Strain Energies of Spherical Sandwich Shells PH Shah, RC Batra AIAA journal 57 (11), 4942-4952, 2019 | 4 | 2019 |
| Bond pads for low temperature hybrid bonding P Shah, MS Bhagavat US Patent 10,937,755, 2021 | 1 | 2021 |
| Fan-out package with reinforcing rivets R Agarwal, MS Bhagavat, P Shah, CH Cheng, BP Wilkerson, L Fu US Patent App. 16/544,021, 2021 | 1 | 2021 |
| Optimal Lid Design Parameters for Reducing Warpage of Flip-chip Package P Shah, M Bhagavat International Symposium on Microelectronics 2019 (1), 000110-000114, 2019 | 1 | 2019 |
| Molded semiconductor chip package with stair-step molding layer P Shah, R Agarwal, MS Bhagavat, CH Cheng US Patent App. 16/822,353, 2021 | | 2021 |
| Semiconductor chip with reduced pitch conductive pillars P Shah, MS Bhagavat, L Fu US Patent App. 17/195,046, 2021 | | 2021 |
| Bond pads for low temperature hybrid bonding P Shah, MS Bhagavat US Patent App. 17/189,324, 2021 | | 2021 |
| Semiconductor chip with reduced pitch conductive pillars P Shah, MS Bhagavat, L Fu US Patent 10,943,880, 2021 | | 2021 |
| Molded chip package with anchor structures P Shah, MS Bhagavat, BP Wilkerson, L Fu, R Agarwal US Patent App. 16/513,450, 2021 | | 2021 |
| Fan-out package with multi-layer redistribution layer structure R Agarwal, MS Bhagavat, P Shah US Patent 10,593,620, 2020 | | 2020 |
Romesh C. BatraUniversity Distinguished Professor and Clifton C. Garvin Professor of Engineering Science andEmail verificata su vt.edu
