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Co-authors
- Naga BhushanVP of Technology, Qualcomm IncorporatedVerified email at qti.qualcomm.com
- Alexandros ManolakosSenior Staff Systems Engineer, WR&D Qualcomm Inc. San Diego, CAVerified email at stanford.edu
- Wanshi ChenQualcomm Inc.Verified email at qti.qualcomm.com
- Behnaam AazhangJ.S. Abercrombie Professor in Electrical and Computer Engineering, Rice UniversityVerified email at rice.edu
- Ashutosh SabharwalErnest D. Butcher Professor, Department of Electrical and Computer EngineeringVerified email at rice.edu
- Bojan VrceljXR Research @ QualcommVerified email at qti.qualcomm.com
- Sundar Subramaniandirector of engineeringVerified email at qti.qualcomm.com
- Muhammad Nazmul IslamQualcommVerified email at qti.qualcomm.com
- Elza ErkipNew York UniversityVerified email at nyu.edu
- Gabi SarkisQualcommVerified email at mail.mcgill.ca
- Navid AbediniQualcomm, Texas A&M, Sharif UniversityVerified email at qti.qualcomm.com
- Chih-Ping LiQualcomm Research, Qualcomm Technologies, Inc.Verified email at qti.qualcomm.com
- Durga MalladiQualcomm Inc.Verified email at qti.qualcomm.com
- Jorma LillebergAdjunct Professor, ECE, Rice UniversityVerified email at rice.edu
- Zhiyuan YanLehigh UniversityVerified email at lehigh.edu
- Xinmiao ZhangThe Ohio State UniversityVerified email at case.edu
- An Mei ChenVP, Engineering, Qualcomm, Inc.Verified email at qualcomm.com
- Vasanthan RaghavanPrincipal Engineer, QualcommVerified email at ieee.org