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- Chun LiUniversity of Electronic Science and Technology of ChinaVerified email at uestc.edu.cn
- Johnny C. HoAssociate Head and Professor, Materials Science and Engin., City University of Hong KongVerified email at cityu.edu.hk
- Sen Po YIPAssociate Professor, Kyushu UniversityVerified email at m.kyushu-u.ac.jp
- Yong LiuProfessor, University of Electronic Science and Technology of ChinaVerified email at uestc.edu.cn
- Renjie (Leon) WeiCorningVerified email at corning.com
- You MENG (孟优)Ctiy University of Hong Kong, Postdoc FellowVerified email at my.cityu.edu.hk
- Dapan LIDepartment of Materials Science and Engineering, City University of Hong KongVerified email at cityu.edu.hk
- Xiuming BuShanghai Institute of Ceramics, Chinese Academy of ScienceVerified email at mail.sic.ac.cn
- Jiangfeng GongHohai UniversityVerified email at hhu.edu.cn
- Shangjian ZhangUniversity of Electronic Science and Technology of ChinaVerified email at uestc.edu.cn
- Xiaoguang LiangCity University of Hong KongVerified email at my.cityu.edu.hk
- ning hanInstitute of Process Engineering, CASVerified email at home.ipe.ac.cn
- Sai Wing TSANGAssociate Professor, Department of Materials Science and Engineering, City University of Hong KongVerified email at cityu.edu.hk
- Guofa DONGCity University of Hong KongVerified email at my.cityu.edu.hk
- Ming Fang (方明)College of Materials Science and Engineering,Shenzhen UniversityVerified email at szu.edu.cn
- Yu-Lun ChuehNational Tsing Huniversity, Materials Science and EngineeringVerified email at mx.nthu.edu.tw
- Xiuwen Xu (徐修文)Professor, Nanjing University of Posts and TelecommunicationsVerified email at njupt.edu.cn
- Qing-Ping DingAmes National Laboratory, Iowa State UniversityVerified email at ameslab.gov
- Zhiqiang WangResearch Associate, Department of Chemistry, University of Western OntarioVerified email at uwo.ca