Cemil S. Geyik
Cited by
Cited by
AustinMan and AustinWoman: High fidelity, reproducible, and open-source electromagnetic voxel models
JW Massey, CS Geyik, N Techachainiran, C Hsu, RQ Nguyen, T Latson, ...
Bioelectromagnetic Society 34th Annual Meeting, 2012
FDTD vs. AIM for bioelectromagnetic analysis
CS Geyik, F Wei, JW Massey, AE Yilmaz
Antennas and Propagation Society International Symposium (APSURSI), 2012†…, 2012
Error measures for comparing bioelectromagnetic simulators
F Wei, JW Massey, CS Geyik, AE Yilmaz
Proceedings of the 2012 IEEE International Symposium on Antennas and†…, 2012
Energy per operation optimization for energy-harvesting wearable IoT devices
J Park, G Bhat, A Nk, CS Geyik, UY Ogras, HG Lee
Sensors 20 (3), 764, 2020
Application of AIM to high-resolution bioelectromagnetics simulations
T Malas, F Wei, J Massey, CS Geyik, AE Yılmaz
Proc. Appl. Comput. Electromagn. Soc. Symp., 558-563, 2011
Energy-optimal gesture recognition using self-powered wearable devices
J Park, G Bhat, CS Geyik, UY Ogras, HG Lee
2018 IEEE Biomedical Circuits and Systems Conference (BioCAS), 1-4, 2018
AustinMan electromagnetic voxels
JW Massey, CS Geyik, M Ball, P Findell, AE Yilmaz
Impact of use conditions on dielectric and conductor material models for high-speed package interconnects
CS Geyik, YS Mekonnen, Z Zhang, K AygŁn
IEEE Transactions on Components, Packaging and Manufacturing Technology 9†…, 2019
A comparison of accuracy-efficiency tradeoffs of FDTD and FFT-accelerated integral equation methods for numerical dosimetry
JW Massey, F Wei, CS Geyik, AE Yılmaz
Bioelectromagnetic Society 35th Annual Meeting, 2013
A methodology to empirically compare computational bioelectromagnetics methods: evaluation of three competitive methods
JW Massey, F Wei, CS Geyik, AE Yılmaz
IEEE Transactions on Antennas and Propagation 66 (8), 4123-4136, 2018
Optimizing Operations per Joule for Energy Harvesting IoT Devices
J Park, G Bhat, CS Geyik, HG Lee, UY Ogras
Technical Report, Arizona State University, 2018
Improved Package Modeling and Correlation Methodology for High Speed IO Design
CS Geyik, Z Zhang, K AygŁn
66th Electronic Components and Technology Conference (ECTC), 985 - 991, 2016
Accuracy-efficiency comparison of finite-difference time-domain and adaptive integral method based simulators for bioelectromagnetics
CS Geyik
Temperature impact on surface roughness modeling for on-package high speed interconnects
CS Geyik, Z Zhang, SR Christ, LE Wojewoda, K AygŁn
2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging†…, 2018
Decoding human intent using a wearable system and multi-modal sensor data
CS Geyik, A Dutta, UY Ogras, DW Bliss
2016 50th Asilomar Conference on Signals, Systems and Computers, 846-850, 2016
Measurement Uncertainty Propagation in the Validation of High-Speed Interconnects
CS Geyik, MJ Hill, Z Zhang, K AygŁn, JT Aberle
2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging†…, 2020
Interconnect loss of high density package with magnetic material
Z Qian, C Geyik, JW Sun, G Duan, K AygŁn
US Patent App. 16/596,383, 2021
Machine Learning for Evaluating the Impact of Manufacturing Process Variations in High-Speed Interconnects
CS Geyik, Z Zhang, K AygŁn, JT Aberle
2021 22nd International Symposium on Quality Electronic Design (ISQED), 160-163, 2021
Scalable high speed high bandwidth io signaling package architecture and method of making
S Ganesan, RL Sankman, A Sain, SCJ Chavali, L Wang, C Geyik
US Patent App. 16/521,435, 2021
Density-graded adhesion layer for conductors
RN Manepalli, K Aygun, SV Pietambaram, CS Geyik
US Patent App. 16/412,464, 2020
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