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Thorsten Lill
Thorsten Lill
Clarycon Nanotechnology Research
Email verificata su claryconresearch.com - Home page
Titolo
Citata da
Citata da
Anno
Overview of atomic layer etching in the semiconductor industry
KJ Kanarik, T Lill, EA Hudson, S Sriraman, S Tan, J Marks, V Vahedi, ...
Journal of Vacuum Science & Technology A 33 (2), 2015
5922015
Method for fabricating a gate structure of a field effect transistor
W Liu, TB Lill, DSL Mui, CD Bencher
US Patent 6,924,191, 2005
4602005
Method of etching high aspect ratio features in a dielectric layer
JM Kim, KL Doan, L Ling, J Payyapilly, D Shimuzu, SD Nemani, TB Lill
US Patent App. 13/656,578, 2013
4412013
High aspect ratio etch with combination mask
J Guha, SK Reddy, K Chattopadhyay, TW Mountsier, A Eppler, T Lill, ...
US Patent 9,018,103, 2015
3672015
Methods of trimming amorphous carbon film for forming ultra thin structures on a substrate
M Shen, DX Ma, WH Yeh, K MacWilliams, W Liu, TB Lill
US Patent App. 12/163,888, 2009
3072009
Integrating atomic scale processes: ALD (atomic layer deposition) and ale(atomic layer etch)
K Kanarik, J Marks, H Singh, S Tan, A Kabansky, W Yang, T Kim, ...
3042019
Internal plasma grid for semiconductor fabrication
H Singh, T Lill, V Vahedi, A Paterson, M Titus, G Kamarthy
2032019
Methodology for in-situ and real-time chamber condition monitoring and process recovery during plasma processing
S Xu, T Lill
US Patent 7,067,432, 2006
1942006
Endpoint detection for semiconductor processes
MN Grimbergen, TB Lill
US Patent 6,081,334, 2000
1832000
Method of making small transistor lengths
TB Lill, J Kretz
US Patent 6,914,009, 2005
1802005
Cobalt etch back
J Yang, B Zhou, M Shen, T Lill, J Hoang
1732018
Pulsed plasma high aspect ratio dielectric process
A Agarwal, KS Collins, S Rauf, K Ramaswamy, TB Lill
US Patent 8,382,999, 2013
1512013
Isotropic atomic layer etch for silicon and germanium oxides
T Lill, IL Berry III, M Shen, AM Schoepp, DJ Hemker
US Patent 9,431,268, 2016
1382016
Workpiece support for a plasma reactor with controlled apportionment of rf power to a process kit ring
KS Collins, DA Buchberger Jr, K Ramaswamy, S Rauf, H Hanawa, JY Sun, ...
1222010
Predicting synergy in atomic layer etching
KJ Kanarik, S Tan, W Yang, T Kim, T Lill, A Kabansky, EA Hudson, T Ohba, ...
Journal of Vacuum Science & Technology A 35 (5), 2017
1112017
Processing technologies for advanced Ge devices
R Loo, AY Hikavyy, L Witters, A Schulze, H Arimura, D Cott, J Mitard, ...
ECS Journal of Solid State Science and Technology 6 (1), P14, 2016
111*2016
Process for control of the shape of the etch front in the etching of polysilicon
T Lill, M Grimbergen
US Patent 6,074,954, 2000
1092000
Near specular reflection of C60 ions in collisions with an HOPG graphite surface
H Busmann, Lill
Chemical Physics Letters 187 (5), 459-465, 1991
1041991
Dry plasma etch method to pattern MRAM stack
Tan, K Samantha, Y Taeseung, M Wenbing, L Jeffrey, Thorsten
US Patent 9,806,252, 2017
1022017
Ceramic article with reduced surface defect density and process for producing a ceramic article
RG Duan, T Lill, JY Sun, B Schwarz
US Patent 9,034,199, 2015
1022015
Il sistema al momento non può eseguire l'operazione. Riprova più tardi.
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