| Promotion of water-mediated carbon removal by nanostructured barium oxide/nickel interfaces in solid oxide fuel cells L Yang, YM Choi, W Qin, H Chen, K Blinn, M Liu, P Liu, J Bai, TA Tyson, ... Nature communications 2 (1), 357, 2011 | 362 | 2011 |
| Anomalous pseudocapacitive behavior of a nanostructured, mixed-valent manganese oxide film for electrical energy storage MK Song, S Cheng, H Chen, W Qin, KW Nam, S Xu, XQ Yang, ... Nano letters 12 (7), 3483-3490, 2012 | 289 | 2012 |
| Enhancement of La 0.6 Sr 0.4 Co 0.2 Fe 0.8 O 3-δ durability and surface electrocatalytic activity by La 0.85 Sr 0.15 MnO 3±δ investigated using a new test electrode platform ME Lynch, L Yang, W Qin, JJ Choi, M Liu, K Blinn, M Liu Energy & Environmental Science 4 (6), 2249-2258, 2011 | 213 | 2011 |
| Direct octane fuel cells: A promising power for transportation M Liu, YM Choi, L Yang, K Blinn, W Qin, P Liu, M Liu Nano Energy 1 (3), 448-455, 2012 | 148 | 2012 |
| Making sense of nanocrystal lattice fringes P Fraundorf, W Qin, P Moeck, E Mandell Journal of Applied Physics 98 (11), 2005 | 50 | 2005 |
| Lattice parameters from direct-space images at two tilts W Qin, P Fraundorf Ultramicroscopy 94 (3-4), 245-262, 2003 | 34 | 2003 |
| Electrical and electrocatalytic properties of a La0. 8Sr0. 2Co0. 17Mn0. 83O3− δ cathode for intermediate-temperature solid oxide fuel cells Y Bai, M Liu, D Ding, K Blinn, W Qin, J Liu, M Liu Journal of Power Sources 205, 80-85, 2012 | 33 | 2012 |
| FIB failure analysis of memory arrays AA Volinsky, L Rice, W Qin, ND Theodore Microelectronic Engineering 75 (1), 3-11, 2004 | 29 | 2004 |
| Corrosion mechanisms of Cu wire bonding on Al pads W Qin, H Anderson, T Anderson, G Chang, D Barrientos 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1446-1454, 2018 | 19 | 2018 |
| Surface oxide evolution on Al–Si bond wires for high-power RF applications W Qin, R Doyle, T Scharr, M Shah, M Kottke, G Chen, D Theodore Microelectronic engineering 75 (1), 111-116, 2004 | 16 | 2004 |
| Mechanism to improve the reliability of copper wire bonding with palladium-coating of the wire W Qin, T Anderson, G Chang Microelectronics Reliability 99, 239-244, 2019 | 9 | 2019 |
| Direct space(nano) crystallography via high-resolution transmission electron microscopy W Qin University of Missouri, St. Louis, 2000 | 8 | 2000 |
| Image-based nanocrystallography by means of transmission electron goniometry P Moeck, W Qin, P Fraundorf Nonlinear Analysis: Theory, Methods & Applications 63 (5-7), e1323-e1331, 2005 | 7 | 2005 |
| Spontaneous oxide reduction in metal stacks W Qin, AA Volinsky, D Werho, ND Theodore, M Kottke, C Ramiah Thin Solid Films 473 (2), 236-240, 2005 | 6 | 2005 |
| Wire bonding systems and related methods QIN Wentao, GM Grivna, H Anderson, T Anderson, G Chang US Patent 10,109,610, 2018 | 5 | 2018 |
| Towards 3D image-based nanocrystallography by means of transmission electron goniometry P Moeck, W Qin, PB Fraundorf MRS Online Proceedings Library (OPL) 839, P4. 3, 2004 | 5 | 2004 |
| Copper Wire Bond Optimization for Power Devices T Pinili, R Manolo, A Denoyo, B Yabut, D Moore, B Cowell, J Jenson, ... 2018 IEEE International Symposium on the Physical and Failure Analysis of …, 2018 | 4 | 2018 |
| Stress-induced anisotropy of graphitelike amorphous carbon S Zollner, W Qin, RB Gregory, NV Edwards, K Junker, TE Tiwald Journal of Applied Physics 101 (5), 2007 | 4 | 2007 |
| Image-based nanocrystallography in future aberration-corrected transmission electron microscopes P Moeck, W Qin, PB Fraundorf MRS Online Proceedings Library (OPL) 818, M11. 3.1, 2004 | 4 | 2004 |
| Foreword: Special Section on “The Reliability of Advanced Microelectronic Packaging—Part I: Management of Thermal Effects” Y Li, W Qin IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 3 | 2020 |
