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Bongsub Lee  (Bong-Sub Lee)
Bongsub Lee (Bong-Sub Lee)
Director, Design, Analysis, & Technology Transfer, Xperi Corp.
Email verificata su xperi.com - Home page
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Citata da
Citata da
Anno
Investigation of the optical and electronic properties of Ge2Sb2Te5 phase change material in its amorphous, cubic, and hexagonal phases
BS Lee, JR Abelson, SG Bishop, DH Kang, B Cheong, KB Kim
Journal of applied physics 97 (9), 093509, 2005
4482005
Thermal conductivity of phase-change material Ge2Sb2Te5
HK Lyeo, DG Cahill, BS Lee, JR Abelson, MH Kwon, KB Kim, SG Bishop, ...
Applied physics letters 89 (15), 151904-151904-3, 2006
3502006
Observation of the role of subcritical nuclei in crystallization of a glassy solid
BS Lee, GW Burr, RM Shelby, S Raoux, CT Rettner, SN Bogle, ...
Science 326 (5955), 980-984, 2009
1922009
Low-temperature processing of B4C–Al composites via infiltration technique
BS Lee, S Kang
Materials chemistry and physics 67 (1), 249-255, 2001
1262001
Nanoscale nuclei in phase change materials: Origin of different crystallization mechanisms of Ge2Sb2Te5 and AgInSbTe
BS Lee, RM Shelby, S Raoux, CT Retter, GW Burr, SN Bogle, ...
Journal of Applied Physics 115 (6), 063506, 2014
682014
Observation and modeling of polycrystalline grain formation in Ge2Sb2Te5
GW Burr, P Tchoulfian, T Topuria, C Nyffeler, K Virwani, A Padilla, ...
Journal of Applied Physics 111 (10), 104308, 2012
682012
Electronic, optical and thermal properties of the hexagonal and rocksalt-like Ge2Sb2Te5 chalcogenide from first-principle calculations
T Tsafack, E Piccinini, BS Lee, E Pop, M Rudan
Journal of Applied Physics 110 (6), 063716, 2011
642011
Nanometer-scale order in amorphous Ge2Sb2Te5 analyzed by fluctuation electron microscopy
MH Kwon, BS Lee, SN Bogle, LN Nittala, SG Bishop, JR Abelson, ...
Applied physics letters 90, 021923, 2007
562007
STRUCTURE AND METHOD FOR INTEGRATED CIRCUITS PACKAGING WITH INCREASED DENSITY
CG Woychik, AR Sitaram, A Cao, B Lee
US Patent 10,381,326 B2, 2019
422019
Distribution of nanoscale nuclei in the amorphous dome of a phase change random access memory
BS Lee, K Darmawikarta, S Raoux, YH Shih, Y Zhu, SG Bishop, ...
Applied Physics Letters 104 (7), 071907, 2014
312014
Direct bond interconnect (DBI) for fine-pitch bonding in 3D and 2.5 D integrated circuits
L Wang, G Fountain, B Lee, G Gao, C Uzoh, S McGrath, P Enquist, ...
2017 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-6, 2017
292017
Large metal pads over tsv
G Gao, LEE Bongsub, GG Fountain Jr, CE Uzoh, LW Mirkarimi, B Haba, ...
US Patent App. 16/439,622, 2019
272019
Scaling Package Interconnects Below 20m Pitch with Hybrid Bonding
G Gao, L Mirkarimi, G Fountain, L Wang, C Uzoh, T Workman, G Guevara, ...
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 314-322, 2018
272018
Bonded structures
R Katkar, LW Mirkarimi, LEE Bongsub, GG Fountain Jr, CE Uzoh
US Patent 11,004,757, 2021
232021
Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding
G Gao, L Mirkarimi, T Workman, G Fountain, J Theil, G Guevara, P Liu, ...
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 628-635, 2019
232019
Fluctuation Transmission Electron Microscopy: Detecting Nanoscale Order in Disordered Structures
BS Lee, SG Bishop, JR Abelson
ChemPhysChem 11 (11), 2311-2317, 2010
172010
Development of Low Temperature Direct Bond Interconnect Technology for Die-To-Wafer and Die-To-Die Applications-Stacking, Yield Improvement, Reliability Assessment
G Gao, L Mirkarimi, T Workman, G Guevara, J Theil, C Uzoh, G Fountain, ...
2018 International Wafer Level Packaging Conference (IWLPC), 1-7, 2018
152018
Optical and electrical properties of phase change materials
BS Lee, SG Bishop
Phase Change Materials, 175-198, 2009
152009
Die to Wafer Stacking with Low Temperature Hybrid Bonding
G Gao, T Workman, C Uzoh, KM Bang, L Mirkarimi, J Theil, D Suwito, ...
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 589-594, 2020
142020
Chip to Wafer Hybrid Bonding with Cu Interconnect: High Volume Manufacturing Process Compatibility Study
G Gao, T Workman, L Mirkarimi, G Fountain, J Theil, G Guevara, C Uzoh, ...
2019 International Wafer Level Packaging Conference (IWLPC), 1-9, 2019
112019
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