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Co-authors
Michael LangbergUniversity at BuffaloVerified email at buffalo.edu- Mayank BakshiResearch Assistant Professor, Chinese University of Hong KongVerified email at inc.cuhk.edu.hk
- Tracey HoAssistant Professor of Electrical Engineering and Computer Science, CaltechVerified email at caltech.edu
- Michelle EffrosProfessor of Electrical Engineering, California Institute of TechnologyVerified email at caltech.edu
- Muriel MedardProfessor of EECS, MITVerified email at mit.edu
- Minghua ChenInformation Engineering, The Chinese University of Hong KongVerified email at ie.cuhk.edu.hk
- Bikash DeyProfessor of Electrical Engineering, IIT BombayVerified email at ee.iitb.ac.in
- Philip ChouGoogleVerified email at google.com
- Sachin KattiDepts of EE & CS, Stanford UniversityVerified email at stanford.edu
- Dina KatabiProfessor of EECS, MITVerified email at ai.mit.edu
- Peter SandersProfessor of Computer Science, Karlsruhe Institute of TechnologyVerified email at kit.edu
- Venkatesh SaligramaProfessor, Electrical and Computer Engineering, Boston UniversityVerified email at bu.edu
- Samar AgnihotriIIT MandiVerified email at iitmandi.ac.in
- Anand SarwateAssistant Professor, Rutgers UniversityVerified email at rutgers.edu
- Swanand KadheUniversity of California BerkeleyVerified email at berkeley.edu
- Zhang Qiaosheng (Eric)National University of SingaporeVerified email at ie.cuhk.edu.hk
- Alex SprintsonProfessor of Electrical and Computer EngineeringVerified email at tamu.edu
- Saurabh ShintrePrincipal Researcher, Symantec Research LabsVerified email at symantec.com
- Chung ChanThe Chinese University of Hong KongVerified email at alum.mit.edu
- Devavrat ShahMassachusetts Institute of TechnologyVerified email at mit.edu
Sidharth Jaggi
Associate Professor of Information Engineering, The Chinese University of Hong Kong
Verified email at ie.cuhk.edu.hk - Homepage