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- Chengshan XiaoLehigh UniversityEmail verificata su campus.mccd.edu
- Yahong Rosa ZhengDept of Electrical and Computer EngineeringEmail verificata su lehigh.edu
- Mukul GagraniQualcomm AI ResearchEmail verificata su usc.edu
- Wonseok JeonQualcomm AI ResearchEmail verificata su qti.qualcomm.com
- Corrado RainoneResearch Engineer, Qualcomm AI ResearchEmail verificata su qti.qualcomm.com
- Robert SchoberFriedrich-Alexander-University Erlangen-NurembergEmail verificata su fau.de
- Harris TeagueQualcomm, Inc.Email verificata su qti.qualcomm.com
- Roberto BondesanImperial College LondonEmail verificata su imperial.ac.uk
- Khaled B. LetaiefMember of US National Academy of Engineering and New Bright Professor of Engineering, HKUSTEmail verificata su ust.hk
- Zhi DingDistinguished Professor of Electrical and Computer Engineering, University of California DavisEmail verificata su ucdavis.edu
- Herke van HoofUniversity of Amsterdam (UVA)Email verificata su uva.nl
- Feng KeSouth China University of TechnologyEmail verificata su scut.edu.cn
- Burak BartanResearcher, Qualcomm AI ResearchEmail verificata su stanford.edu
- Xiaoming TaoTsinghua UniversityEmail verificata su mail.tsinghua.edu.cn
- Shaoyang LiColumbia UniversityEmail verificata su columbia.edu
- Yang YangGoogleEmail verificata su google.com