| Copper CMP modeling: millisecond scale adsorption kinetics of BTA in glycine-containing solutions at pH 4 S Choi, S Tripathi, DA Dornfeld, FM Doyle Journal of The Electrochemical Society 157 (12), H1153, 2010 | 33 | 2010 |
| Strategies for burr minimization and cleanability in aerospace and automotive manufacturing MC Avila, JD Gardner, C Reich-Weiser, A Vijayaraghavan, D Dornfeld SAE Transactions Journal of Aerospace 114 (1), 2006 | 32 | 2006 |
| Review of geometric solutions for milling burr prediction and minimization S Tripathi, DA Dornfeld Proceedings of the Institution of Mechanical Engineers, Part B: Journal of …, 2006 | 25 | 2006 |
| Fundamental mechanisms of copper CMP–passivation kinetics of copper in CMP Slurry Constituents S Tripathi, FM Doyle, DA Dornfeld MRS Online Proceedings Library (OPL) 1157, 1157-E06-02, 2009 | 16 | 2009 |
| Integrated tribo-chemical modeling of copper CMP S Tripathi, S Choi, FM Doyle, DA Dornfeld MRS Online Proceedings Library (OPL) 1157, 1157-E02-03, 2009 | 11 | 2009 |
| Burr minimization strategies and cleanability in the aerospace and automotive industry M Avila, J Gardner, C Reich-Weiser, A Vijayaraghavan, S Tripathi, ... SAE Transactions Journal of Aerospace 114 (1), 1073-1082, 2005 | 11 | 2005 |
| Tribo-chemical mechanisms of copper chemical mechanical planarization (CMP)-Fundamental investigations and integrated modeling S Tripathi University of California, Berkeley, 2008 | 6 | 2008 |
| Chip Scale Prediction of Nitride Erosion in High Selectivity STI CMP J Choi, S Tripathi, DA Hansen, D Dornfeld | 6 | 2006 |
| Chip scale prediction of nitride erosion in high selective STI CMP J Choi, S Tripathi, D Hansen, DA Dornfeld 2006 CMP-MIC Conference, 160-167, 2006 | 5 | 2006 |
| CMP Modeling as a part of Design for Manufacturing S Tripathi, A Monvoisin, D Dornfeld, FM Doyle International Conference on Planarization/CMP Technology, 1-6, 2007 | 4 | 2007 |
| Integrated tribo-chemical modeling of copper CMP S Choi, S Tripathi, FM Doyle, DA Dornfeld Mater. Res. Soc. Symp. Proc. 1157, E02–E03, 2009 | 2 | 2009 |
| Tribo-chemical modeling of copper CMP S Tripathi, F Doyle, D Dornfeld | 2 | 2006 |
| Jim Evans: A Reflection on his Impact F Doyle Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box …, 2010 | | 2010 |
| Fundamental Mechanisms of Copper CMP–Passivation Kinetics of Copper in CMP Slurry S Tripathi, FM Doyle, D Dornfeld | | 2009 |
| IMPACT S Tripathi, FM Doyle, D Dornfeld | | 2008 |
| CMP Modeling as a part of Design for Manufacturing D Dornfeld, S Tripathi, A Monvoisin, FM Doyle, DA Dornfeld | | 2007 |
| Tool Path Planning for Reconfigurable Machines S Tripathi, DA Dornfeld | | 2005 |
Seungchoun ChoiCorning Precision MaterialsEmail verificata su corning.com
