| On the reliability of convolutional neural network implementation on SRAM-based FPGA B Du, S Azimi, C De Sio, L Bozzoli, L Sterpone 2019 IEEE International Symposium on Defect and Fault Tolerance in VLSI and …, 2019 | 38 | 2019 |
| PyXEL: an integrated environment for the analysis of fault effects in SRAM-based FPGA routing L Bozzoli, C De Sio, L Sterpone, C Bernardeschi 2018 International Symposium on Rapid System Prototyping (RSP), 70-75, 2018 | 31 | 2018 |
| Assessing convolutional neural networks reliability through statistical fault injections A Ruospo, G Gavarini, C De Sio, J Guerrero, L Sterpone, MS Reorda, ... 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE), 1-6, 2023 | 26 | 2023 |
| FireNN: Neural networks reliability evaluation on hybrid platforms C De Sio, S Azimi, L Sterpone IEEE Transactions on Emerging Topics in Computing 10 (2), 549-563, 2022 | 22 | 2022 |
| SEU evaluation of hardened-by-replication software in RISC-V soft processor C De Sio, S Azimi, A Portaluri, L Sterpone 2021 IEEE International Symposium on Defect and Fault Tolerance in VLSI and …, 2021 | 22 | 2021 |
| Analyzing radiation-induced transient errors on SRAM-based FPGAs by propagation of broadening effect C De Sio, S Azimi, L Sterpone, B Du IEEE Access 7, 140182-140189, 2019 | 21 | 2019 |
| A radiation-hardened CMOS full-adder based on layout selective transistor duplication S Azimi, C De Sio, L Sterpone IEEE Transactions on Very Large Scale Integration (VLSI) Systems 29 (8 …, 2021 | 20 | 2021 |
| On the analysis of radiation-induced failures in the AXI interconnect module C De Sio, S Azimi, L Sterpone Microelectronics Reliability 114, 113733, 2020 | 19 | 2020 |
| Radiation-induced Single Event Transient effects during the reconfiguration process of SRAM-based FPGAs C De Sio, S Azimi, L Bozzoli, B Du, L Sterpone Microelectronics Reliability 100, 113342, 2019 | 17 | 2019 |
| An emulation platform for evaluating the reliability of deep neural networks C De Sio, S Azimi, L Sterpone 2020 IEEE International Symposium on Defect and Fault Tolerance in VLSI and …, 2020 | 16 | 2020 |
| Analysis of single event effects on embedded processor S Azimi, C De Sio, D Rizzieri, L Sterpone Electronics 10 (24), 3160, 2021 | 15 | 2021 |
| A comparative radiation analysis of reconfigurable memory technologies: FinFET versus bulk CMOS S Azimi, C De Sio, A Portaluri, D Rizzieri, L Sterpone Microelectronics Reliability 138, 114733, 2022 | 14 | 2022 |
| A New Domains-based Isolation Design Flow for Reconfigurable SoCs A Portaluri, C De Sio, S Azimi, L Sterpone 2021 IEEE 27th International Symposium on On-Line Testing and Robust System …, 2021 | 12 | 2021 |
| Single-event-effect propagation investigation on nanoscale system on chip by applying heavy-ion microbeam and event tree analysis WT Yang, XC Du, YH Li, CH He, G Guo, ST Shi, L Cai, S Azimi, C De Sio, ... Nuclear Science and Techniques 32 (10), 106, 2021 | 10 | 2021 |
| Test, reliability and functional safety trends for automotive system-on-chip F Angione, D Appello, J Aribido, J Athavale, N Bellarmino, P Bernardi, ... 2022 IEEE European Test Symposium (ETS), 1-10, 2022 | 8 | 2022 |
| Analysis of radiation-induced transient errors on 7 nm FinFET technology S Azimi, C De Sio, L Sterpone Microelectronics Reliability 126, 114319, 2021 | 8 | 2021 |
| On the evaluation of SEU effects on AXI interconnect within AP-SoCs C De Sio, S Azimi, L Sterpone Architecture of Computing Systems–ARCS 2020: 33rd International Conference …, 2020 | 8 | 2020 |
| Layout-oriented radiation effects mitigation in RISC-V soft processor E Vacca, C De Sio, S Azimi Proceedings of the 19th ACM International Conference on Computing Frontiers …, 2022 | 6 | 2022 |
| PyXEL: Exploring Bitstream Analysis to Assess and Enhance the Robustness of Designs on FPGAs C De Sio, S Azimi, L Sterpone, DM Codinachs, F Decuzzi 2023 19th International Conference on Synthesis, Modeling, Analysis and …, 2023 | 5 | 2023 |
| Evaluating reliability against SEE of embedded systems: A comparison of RTOS and bare-metal approaches C De Sio, S Azimi, L Sterpone Microelectronics Reliability 150, 115124, 2023 | 4 | 2023 |
Luca SterponePolitecnico di TorinoEmail verificata su polito.it
