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- Dheeraj MohataSenior Integration Engineer, GCS IncEmail verificata su gcsincorp.com
- Huichu LiuIntel Labs, Intel CorporationEmail verificata su intel.com
- Theresa MayerPurdue UniversityEmail verificata su purdue.edu
- David GundlachNational Institute of Standards and TechnologyEmail verificata su nist.gov
- Prof. Mantu HudaitAssoc. Prof. of ECE, Virginia Tech; Past: Intel Corporation, Ohio State U, IISc-Bangalore, IIT-KGPEmail verificata su vt.edu
- Himanshu MadanIntel, PennState UniversityEmail verificata su intel.com
- Roman Engel-HerbertDirektor, Paul-Drude-Institut für Festkörperelektronik, Leibniz Institut im Foschungsverbund BerlinEmail verificata su pdi-berlin.de
- Yan ZhuToshiba America Electronic ComponentsEmail verificata su vt.edu
- Matthew J. HollanderPennsylvania State UniversityEmail verificata su psu.edu
- Gerhard KlimeckProfessor of Electrical and Computer Engineering, Purdue UniversityEmail verificata su purdue.edu
- Ashkar AliIntel CorporationEmail verificata su psu.edu
- Abhijeet paulGraduate Student Purdue University, Device Engineer GlobalfoundriesEmail verificata su globalfoundries.com
- Dmitry ZhernokletovIntermolecular Inc.Email verificata su intermolecular.com
- Souvik MahapatraProfessor, EE Dept, IIT Bombay (Fellow of IEEE, INSA, IASc, INAE)Email verificata su ee.iitb.ac.in
- Barry BrennanAtlantic Technological UniversityEmail verificata su atu.ie
- Robert M. WallaceUniversity of Texas at DallasEmail verificata su utdallas.edu
- Mehmet Onur BaykanAugmented Reality Hardware Reliability Engineer, FacebookEmail verificata su fb.com
- Wei LiHuman-machine Interaction Lab - CanadaEmail verificata su huawei.com