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- Ed HabtourThe University of WashingtonEmail verificata su uw.edu
- Subhasis MukherjeeIC Packaging, AppleEmail verificata su apple.com
- Gayatri CuddalorepattaPostdoctoral AssociateEmail verificata su seas.harvard.edu
- Jingshi MengUniversity of Maryland, College ParkEmail verificata su umd.edu
- Joseph VargheseGoogleEmail verificata su google.com
- Daniel FarleyAnsys Germany GmbHEmail verificata su ansys.com
- Daniel P. ColeU.S. Army Research OfficeEmail verificata su mail.mil
- Koustav SinhaMicron Technology, Inc.Email verificata su micron.com
- Bongtae HanProfessor of Mechanical Engineering, University of MarylandEmail verificata su umd.edu
- Bite Zhou, Ph.D.Failure Analysis R&D Engineer, Intel CorporationEmail verificata su intel.com
- Thomas R. BielerMichigan State UniversityEmail verificata su egr.msu.edu
- John W. EvansNASAEmail verificata su ieee.org
- Samuel StantonUS Air Force AcademyEmail verificata su afacademy.af.edu
- Majed A. MajeedAssociate Professor, Mechanical Engineering Dept., Kuwait UniversityEmail verificata su ku.edu.kw
- Preeti ChauhanGoogle CorporationEmail verificata su intel.com
- Craig HillmanDfR SolutionsEmail verificata su dfrsolutions.com
- Elisabeth SmelaDepartment of Mechanical Engineering, University of MarylandEmail verificata su umd.edu
- Ricky ValentinUniversity of Puerto RicoEmail verificata su upr.edu
- Bavani BalakrisnanCorning Research & DevelopmentEmail verificata su terpalum.umd.edu
- Santiago SolaresThe Catholic University of AmericaEmail verificata su cua.edu
Segui
Abhijit Dasgupta
Professor of Mechanical Engineering, University of Maryland
Email verificata su umd.edu