Khaled Salah
Khaled Salah
Mentor, A Siemens Business
Verified email at mentor.com - Homepage
TitleCited byYear
Equivalent lumped element models for various n-port Through Silicon Vias networks
K Salah, H Ragai, Y Ismail, AE Rouby
Proceedings of the 16th Asia and South Pacific Design Automation Conference …, 2011
292011
Compact lumped element model for TSV in 3D-ICs
K Salah, A El Rouby, H Ragai, K Amin, Y Ismail
2011 IEEE International Symposium of Circuits and Systems (ISCAS), 2321-2324, 2011
242011
Implementation and verification of a generic universal memory controller based on UVM
K Khalifa, K Salah
2015 10th International Conference on Design & Technology of Integrated …, 2015
162015
A uvm-based smart functional verification platform: Concepts, pros, cons, and opportunities
K Salah
2014 9th International Design and Test Symposium (IDT), 94-99, 2014
162014
Arbitrary modeling of TSVs for 3D integrated circuits
K Salah, Y Ismail, A El-Rouby
Springer, 2014
112014
IP Cores Design from Specifications to Production: Modeling, Verification, Optimization, and Protection.
KS Mohamed
Springer International Publishing, 2016. 13-50., 2016
92016
3D/TSV enabling technologies for SOC/NOC: Modeling and design challenges
K Salah, A El Rouby, H Ragai, Y Ismail
2010 International Conference on Microelectronics, 268-271, 2010
92010
A closed form expression for TSV-based on-chip spiral inductor
K Salah, A El Rouby, H Ragai, Y Ismail
2012 IEEE International Symposium on Circuits and Systems, 2325-2328, 2012
82012
A novel model order reduction technique based on artificial intelligence
K Salah
Microelectronics journal 65, 58-71, 2017
72017
Memory controller architectures: A comparative study
K Khalifa, H Fawzy, S El-Ashry, K Salah
2013 8th IEEE Design and Test Symposium, 1-6, 2013
72013
Internet of things: A comparative study
BE El-Shweky, K El-Kholy, M Abdelghany, M Salah, M Wael, O Alsherbini, ...
2018 IEEE 8th Annual Computing and Communication Workshop and Conference …, 2018
62018
Machine Learning for Model Order Reduction
KS Mohamed
Springer 2018, 2018
62018
Compact TSV modeling for low power application
K Salah, A El-Rouby, Y Ismail, H Ragai, K Amin
2010 International Conference on Energy Aware Computing, 1-2, 2010
62010
New TSV-Based applications: Resonant inductive coupling, variable inductor, power amplifier, bandpass filter, and antenna
K Salah, Y Ismail
2015 IEEE 13th International New Circuits and Systems Conference (NEWCAS), 1-4, 2015
52015
Tsv-based 3d integration fabrication technologies: An overview
K Salah
2014 9th International Design and Test Symposium (IDT), 253-256, 2014
52014
Analysis of coupling capacitance between TSVs and metal interconnects in 3D-ICs
K Salah
2012 19th IEEE International Conference on Electronics, Circuits, and …, 2012
52012
Coverage closure efficient UVM based generic verification architecture for flash memory controllers
A El-Yamany, S El-Ashry, K Salah
2016 17th International Workshop on Microprocessor and SOC Test and …, 2016
42016
A SWOT analysis of TSV: Strengths, weaknesses, opportunities, and threats
K Salah
2015 27th International Conference on Microelectronics (ICM), 214-217, 2015
42015
Finite element emulation-based solver for electromagnetic computations
MTI Ziad, M Hossam, MA Masoud, M Nagy, HA Adel, Y Alkabani, ...
2015 IEEE International Symposium on Circuits and Systems (ISCAS), 1434-1437, 2015
42015
A novel memory controller architecture
K Khalifa, H Fawzy, S El-Ashry, K Salah
2014 11th International Conference on Electrical Engineering/Electronics …, 2014
42014
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