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- Matthew LinfordBrigham Young UniversityEmail verificata su chem.byu.edu
- Guangli HuMerckEmail verificata su merck.com
- Timothy M. GrossResearch Fellow, Corning IncorporatedEmail verificata su corning.com
- Adam EllisonCorning Inc.Email verificata su corning.com
- Seong H. KimDepartment of Chemical Engineering, Materials Research Institute, Pennsylvania State UniversityEmail verificata su engr.psu.edu
- Barry M. LuntProfessor of Information Technology, Brigham Young UniversityEmail verificata su byu.edu
- Gabriel AgnelloDevelopment Associate, Corning IncorporatedEmail verificata su corning.com
- George H. MajorPhD Brigham Young University, Texas InstrumentsEmail verificata su ti.com
- Ashutosh GoelProfessor, Materials Science and Engineering, Rutgers University, USAEmail verificata su soe.rutgers.edu
- Michael LanaganPenn State UniversityEmail verificata su psu.edu
- Eric M. PierceSenior Scientist, Oak Ridge National LaboratoryEmail verificata su ornl.gov
- Thomas GrehlIONTOF GmbHEmail verificata su iontof.com
- Nicholas Stone-WeissCorning IncorporatedEmail verificata su corning.com
- Jincheng DuProfessor of Materials Science and Engineering, University of North TexasEmail verificata su unt.edu
- Shiladitya ChatterjeeTechnology Chair, Intel CorporationEmail verificata su byu.edu
- Badri RangarajanThe Pennsylvania State University, Intel Corp.Email verificata su intel.com
- Alastair CormackNY State College of Ceramics at Alfred UniversityEmail verificata su alfred.edu
- Adama TandiaSenior Research Associate, Corning Incorporated, Corning (NY, USA)Email verificata su corning.com
- Aleksey YaremchenkoPrincipal Researcher, CICECO, University of AveiroEmail verificata su ua.pt
- Eugene FurmanPenn State UniversityEmail verificata su psu.edu