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- Inyeal LeeSamsung electronics, Foundry business, Logic Process Architecture IntegrationEmail verificata su skku.edu
- Dongsuk Lim성균관대학교Email verificata su skku.edu
- Muhammad Atif KhanSungkyunkwan UniversityEmail verificata su skku.edu
- Han-Ik JohKonkuk UniversityEmail verificata su konkuk.ac.kr
- Kenji WatanabeNational Institute for Materials ScienceEmail verificata su nims.go.jp
- T.TaniguchiNational Institute for Materials ScienceEmail verificata su nims.go.jp
- Jeong Min BaikSungkyunkwan UniversityEmail verificata su skku.edu
- E. S. KannanGrenoble High magnetic Field Lab, Sungkyunkwan University, BITS-PilaniEmail verificata su goa.bits-pilani.ac.in
- Gwan-Hyoung LeeProfessor, Materials Science and Engineering, Seoul National UniversityEmail verificata su snu.ac.kr
- Dr. KUMUD RANJANNTU, SingaporeEmail verificata su e.ntu.edu.sg
- A. VenkatesanSungkyunkwan UniversityEmail verificata su skku.edu
- Nobuyuki AokiDepertment of Materials ScienceEmail verificata su faculty.chiba-u.jp
- Young-Jun YuAssociate Professor, Department of Physics, Chungnam National UniversityEmail verificata su cnu.ac.kr
- Philip KimHarvard UniversityEmail verificata su g.harvard.edu
- Kuldeep TakharMicron Technology Singapore, IIT BombayEmail verificata su iitb.ac.in
- Yogendra Kumar YadavProcess/integration modelling, Applied Materials BangaloreEmail verificata su iitb.ac.in
- Sang-Woo KIMProfessor of Mater. Sci. Eng., YONSEI UNIVERSITYEmail verificata su yonsei.ac.kr
- Cheol-Ho LeeLG ChemEmail verificata su kaist.ac.kr
- Young Duck KimAssociate Professor, Department of Physics, Kyung Hee University, Seoul 02447, Republic of KoreaEmail verificata su khu.ac.kr
- James C. HoneDepartment of Mechanical Engineering, Columbia UniversityEmail verificata su columbia.edu