| Design Challenges of SiC Devices for Low- and Medium-Voltage DC-DC Converters G Engelmann, A Sewergin, M Neubert, RWD Doncker INTERNATIONAL POWER ELECTRONICS CONFERENCE -ECCE ASIA-, 2018 | 64 | 2018 |
| Experimental Investigation on the Transient Switching Behavior of SiC MOSFETs Using a Stage-Wise Gate Driver G Engelmann, T Senoner, RW De Doncker CPSS Transactions on Power Electronics and Applications 3 (1), 2018 | 61 | 2018 |
| Intelligent gate drivers for future power converters J Henn, C Lüdecke, M Laumen, S Beushausen, S Kalker, ... IEEE Transactions on Power Electronics 37 (3), 3484-3503, 2021 | 58 | 2021 |
| A systematic comparison of hard-and soft-switching topologies for inductive power transfer systems T Diekhans, F Stewing, G Engelmann, H van Hoek, RW De Doncker 2014 4th International Electric Drives Production Conference (EDPC), 1-8, 2014 | 39 | 2014 |
| Temperature Controlled Power Semiconductor Characterization using Thermoelectric Coolers G Engelmann, M Laumen, J Gottschlich, K Oberdieck, RW De Doncker IEEE Transactions on Industry Applications, 2018 | 36 | 2018 |
| Experimental analysis of the switching behavior of an IGBT using a three-stage gate driver G Engelmann, C Lüdecke, D Bündgen, RW De Doncker, X Lu, Z Xu, ... 2017 IEEE 8th International Symposium on Power Electronics for Distributed …, 2017 | 36 | 2017 |
| Experimental and Simulative Investigations on Stray Capacitances and Stray Inductances of Power Modules G Engelmann, S Quabeck, J Gottschlich, RWD Doncker European Conference on Power Electronics and Applications (EPE'17 ECCE Europe), 2017 | 35 | 2017 |
| Toward an In-Depth Understanding of the Commutation Processes in a SiC mosfet Switching Cell Including Parasitic Elements N Fritz, G Engelmann, A Stippich, C Lüdecke, DA Philipps, ... IEEE Transactions on Industry Applications 56 (4), 4089-4101, 2020 | 31 | 2020 |
| A highly integrated drive inverter using DirectFETs and ceramic dc-link capacitors for open-end winding machines in electric vehicles G Engelmann, M Kowal, RW De Doncker 2015 IEEE Applied Power Electronics Conference and Exposition (APEC), 290-296, 2015 | 27 | 2015 |
| Experimental comparison of voltage and current source gate drivers for IGBTs C Ludecke, G Engelmann, K Oberdieck, D Bundgen, RW De Doncker 2017 IEEE 12th International Conference on Power Electronics and Drive …, 2017 | 25 | 2017 |
| Optimized IGBT turn-off switching performance using the full device safe operating area C Lüdecke, G Engelmann, RW De Doncker 2019 IEEE Applied Power Electronics Conference and Exposition (APEC), 1319-1325, 2019 | 23 | 2019 |
| From Ac to Dc: Demonstration of Benefits in Household Appliances A Stippich, A Sewergin, G Engelmann, J Gottschlich, M Neubert, ... INTERNATIONAL ETG CONGRESS 2017, 2017 | 22 | 2017 |
| Optimized IGBT turn-on switching performance using the full device safe operating area C Luedecke, G Engelmann, RW De Doncker PCIM Europe 2019; International Exhibition and Conference for Power …, 2019 | 21 | 2019 |
| Reducing device stress and switching losses using active gate drivers and improved switching cell design G Engelmann, RWA de Doncker, S Heinen Lehrstuhl und Institut für Stromrichtertechnik und Elektrische Antriebe, 2018 | 20 | 2018 |
| Peltier module based temperature control system for power semiconductor characterization G Engelmann, M Laumen, K Oberdieck, RW De Doncker 2016 IEEE International Power Electronics and Motion Control Conference …, 2016 | 17 | 2016 |
| Boost Stage for Gate Current Injection during IGBT Turn-On Event K Oberdieck, C Lüdecke, G Engelmann, RWD Doncker IEEE SPEC, 2017 | 16 | 2017 |
| Impact of the Different Parasitic Inductances on the Switching Behavior of SiC MOSFETs G Engelmann, N Fritz, C Lüdecke, RWD Doncker, Z Xu, X Lu, C Chen, ... International Conference on Power Electronics and Motion Control, 2018 | 14 | 2018 |
| RC snubber design procedure for enhanced oscillation damping in wide-bandgap switching cells N Fritz, G Engelmann, RW De Doncker 2019 21st European Conference on Power Electronics and Applications (EPE'19 …, 2019 | 12 | 2019 |
| A systematic comparison of various thermal interface materials for applications with surface-mounted (DirectFETTM) MOSFETs G Engelmann, T Senoner, H van Hoek, RW De Doncker 2015 IEEE 11th International Conference on Power Electronics and Drive …, 2015 | 12 | 2015 |
| Verfahren zur simulativen Modellierung der Gleichtaktanregung K Oberdieck, G Engelmann, RWD Doncker EMV 2016, 2016 | 7 | 2016 |
Christoph LüdeckeISEA RWTH Aachen UniversityVerified email at rwth-aachen.de
