| Interfacial reactions between Bi-Ag high-temperature solders and metallic substrates JM Song, HY Chuang, ZM Wu Journal of electronic materials 35, 1041-1049, 2006 | 144 | 2006 |
| Microstructure and tensile properties of Sn–9Zn–xAg lead-free solder alloys JM Song, GF Lan, TS Lui, LH Chen Scripta materialia 48 (8), 1047-1051, 2003 | 143 | 2003 |
| Thermal and tensile properties of Bi-Ag alloys JM Song, HY Chuang, TX Wen Metallurgical and Materials Transactions A 38, 1371-1375, 2007 | 115 | 2007 |
| Thermal stability of Cu@ Ag core–shell nanoparticles CH Tsai, SY Chen, JM Song, IG Chen, HY Lee Corrosion Science 74, 123-129, 2013 | 112 | 2013 |
| One-step synthesis of uniform silver nanoparticles capped by saturated decanoate: direct spray printing ink to form metallic silver films TY Dong, WT Chen, CW Wang, CP Chen, CN Chen, MC Lin, JM Song, ... Physical Chemistry Chemical Physics 11 (29), 6269-6275, 2009 | 96 | 2009 |
| Alloying modification of Sn–Ag–Cu solders by manganese and titanium LW Lin, JM Song, YS Lai, YT Chiu, NC Lee, JY Uan Microelectronics Reliability 49 (3), 235-241, 2009 | 94 | 2009 |
| Vibration fracture properties of a lightweight Mg–Li–Zn alloy JM Song, TX Wen, JY Wang Scripta materialia 56 (6), 529-532, 2007 | 78 | 2007 |
| Crystallization, morphology and distribution of Ag3Sn in Sn–Ag–Cu alloys and their influence on the vibration fracture properties JM Song, JJ Lin, CF Huang, HY Chuang Materials Science and Engineering: A 466 (1-2), 9-17, 2007 | 70 | 2007 |
| Nanomechanical responses of intermetallic phase at the solder joint interface–Crystal orientation and metallurgical effects JM Song, BR Huang, CY Liu, YS Lai, YT Chiu, TW Huang Materials Science and Engineering: A 534, 53-59, 2012 | 63 | 2012 |
| Microstructural characteristics and vibration fracture properties of Sn-Ag-Cu-TM (TM= Co, Ni, and Zn) alloys JM Song, CF Huang, HY Chuang Journal of electronic materials 35, 2154-2163, 2006 | 58 | 2006 |
| Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering JM Song, PC Liu, CL Shih, KL Lin Journal of electronic materials 34, 1249-1254, 2005 | 53 | 2005 |
| Resonant vibration behavior of Sn–Zn–Ag solder alloys JM Song, TS Lui, GF Lan, LH Chen Journal of alloys and compounds 379 (1-2), 233-239, 2004 | 52 | 2004 |
| Can copper nanostructures sustain high-quality plasmons? V Mkhitaryan, K March, EN Tseng, X Li, L Scarabelli, LM Liz-Marzán, ... Nano Letters 21 (6), 2444-2452, 2021 | 51 | 2021 |
| Variable eutectic temperature caused by inhomogeneous solute distribution in Sn–Zn system JM Song, ZM Wu Scripta materialia 54 (8), 1479-1483, 2006 | 49 | 2006 |
| Development of Cu-Ag pastes for high temperature sustainable bonding CH Hsiao, WT Kung, JM Song, JY Chang, TC Chang Materials Science and Engineering: A 684, 500-509, 2017 | 48 | 2017 |
| Strain rate dependence on nanoindentation responses of interfacial intermetallic compounds in electronic solder joints with Cu and Ag substrates JM Song, YL Shen, CW Su, YS Lai, YT Chiu Materials transactions 50 (5), 1231-1234, 2009 | 48 | 2009 |
| Behavior of intermetallics in liquid Sn–Zn–Ag solder alloys JM Song, KL Lin Journal of materials research 18 (9), 2060-2067, 2003 | 45 | 2003 |
| Mg-Mg2X (X= Cu, Sn) eutectic alloy for the Mg2X nano-lamellar compounds to catalyze hydrolysis reaction for H2 generation and the recycling of pure X metals from the reaction … SL Li, JM Song, JY Uan Journal of Alloys and Compounds 772, 489-498, 2019 | 44 | 2019 |
| Dissolution behavior of Cu and Ag substrates in molten solders PY Yeh, JM Song, KL Lin Journal of electronic materials 35, 978-987, 2006 | 44 | 2006 |
| Substrate dissolution and shear properties of the joints between Bi-Ag alloys and Cu substrates for high-temperature soldering applications JM Song, HY Chuang, ZM Wu Journal of electronic materials 36, 1516-1523, 2007 | 43 | 2007 |
