Sean King
Sean King
Sr. Technical Contributor
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Cleaning of AlN and GaN surfaces
SW King, JP Barnak, MD Bremser, KM Tracy, C Ronning, RF Davis, ...
Journal of applied physics 84 (9), 5248-5260, 1998
Plasma enhanced atomic layer deposition of SiNx:H and SiO2
SW King
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 29 (4…, 2011
Cleaning of GaN surfaces
LL Smith, SW King, RJ Nemanich, RF Davis
Journal of electronic materials 25 (5), 805-810, 1996
UV photoemission study of heteroepitaxial AlGaN films grown on 6H-SiC
MC Benjamin, MD Bremser, TW Weeks Jr, SW King, RF Davis, ...
Applied Surface Science 104, 455-460, 1996
Transistor having an etch stop layer including a metal compound that is selectively formed over a metal gate
A Ott, S King, A Sharma
US Patent 8,120,114, 2012
Negative electron affinity surfaces of aluminum nitride and diamond
RJ Nemanich, PK Baumann, MC Benjamin, ...
Diamond Relat. Mater 5 (6), 790-796, 1996
Dielectric barrier, etch stop, and metal capping materials for state of the art and beyond metal interconnects
SW King
ECS Journal of Solid State Science and Technology 4 (1), N3029, 2014
Adhesion and electromigration performance at an interface between a dielectric and metal
S King, J Klaus
US Patent 8,178,436, 2012
Fourier transform infrared spectroscopy investigation of chemical bonding in low-k a-SiC: H thin films
SW King, M French, J Bielefeld, WA Lanford
Journal of Non-Crystalline Solids 357 (15), 2970-2983, 2011
Dependence of (0001) GaN/AlN valence band discontinuity on growth temperature and surface reconstruction
SW King, C Ronning, RF Davis, MC Benjamin, RJ Nemanich
Journal of applied physics 84 (4), 2086-2090, 1998
Research Updates: The three M's (materials, metrology, and modeling) together pave the path to future nanoelectronic technologies
SW King, H Simka, D Herr, H Akinaga, M Garner
APL Materials 1 (4), 040701, 2013
Influence of network bond percolation on the thermal, mechanical, electrical and optical properties of high and low-k a-SiC: H thin films
SW King, J Bielefeld, G Xu, WA Lanford, Y Matsuda, RH Dauskardt, N Kim, ...
Journal of Non-Crystalline Solids 379, 67-79, 2013
Wet Chemical Processing of (0001) Si 6H‐SiC Hydrophobic and Hydrophilic Surfaces
SW King, RJ Nemanich, RF Davisa
Journal of the Electrochemical Society 146 (5), 1910-1917, 1999
Intrinsic stress effect on fracture toughness of plasma enhanced chemical vapor deposited SiN x: H films
S King, R Chu, G Xu, J Huening
Thin Solid Films 518 (17), 4898-4907, 2010
Investigation of the impact of insulator material on the performance of dissimilar electrode metal-insulator-metal diodes
N Alimardani, SW King, BL French, C Tan, BP Lampert, JF Conley Jr
Journal of Applied Physics 116 (2), 024508, 2014
Film property requirements for hermetic low-k a-SiOxCyNz: H dielectric barriers
SW King, D Jacob, D Vanleuven, B Colvin, J Kelly, M French, J Bielefeld, ...
ECS Journal of Solid State Science and Technology 1 (6), N115, 2012
Nanoscale mapping of contact stiffness and damping by contact resonance atomic force microscopy
G Stan, SW King, RF Cook
Nanotechnology 23 (21), 215703, 2012
Mass and bond density measurements for PECVD a-SiC x: H thin films using Fourier transform-infrared spectroscopy
SW King, J Bielefeld, M French, WA Lanford
Journal of Non-Crystalline Solids 357 (21), 3602-3615, 2011
X-ray photoelectron spectroscopy measurement of the Schottky barrier at the SiC (N)/Cu interface
SW King, M French, M Jaehnig, M Kuhn, B Boyanov, B French
Journal of Vacuum Science & Technology B, Nanotechnology and…, 2011
Intrinsic stress fracture energy measurements for PECVD thin films in the SiOxCyNz: H system
SW King, JA Gradner
Microelectronics Reliability 49 (7), 721-726, 2009
Il sistema al momento non pu eseguire l'operazione. Riprova pi tardi.
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