| Smart electric vehicle (ev) charging and grid integration apparatus and methods R Gadh, S Mal, S Prabhu, CC Chu, O Sheikh, CY Chung, L He, B Xiao, ... US Patent 9,026,347, 2015 | 252 | 2015 |
| Scaling for edge inference of deep neural networks X Xu, Y Ding, SX Hu, M Niemier, J Cong, Y Hu, Y Shi Nature Electronics 1 (4), 216-222, 2018 | 104 | 2018 |
| Thermal-aware cell and through-silicon-via co-placement for 3D ICs J Cong, G Luo, Y Shi Proceedings of the 48th Design Automation Conference, 670-675, 2011 | 74 | 2011 |
| Thermal via allocation for 3-D ICs considering temporally and spatially variant thermal power H Yu, Y Shi, L He, T Karnik IEEE Transactions on Very Large Scale Integration (VLSI) Systems 16 (12 …, 2008 | 71 | 2008 |
| A universal state-of-charge algorithm for batteries B Xiao, Y Shi, L He Proceedings of the 47th Design Automation Conference, 687-692, 2010 | 69 | 2010 |
| On the efficacy of through-silicon-via inductors UR Tida, R Yang, C Zhuo, Y Shi IEEE Transactions on Very Large Scale Integration (VLSI) Systems 23 (7 …, 2014 | 49 | 2014 |
| An analytical placement framework for 3-D ICs and its extension on thermal awareness G Luo, Y Shi, J Cong IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2013 | 45 | 2013 |
| Novel through-silicon-via inductor-based on-chip DC-DC converter designs in 3D ICs UR Tida, C Zhuo, Y Shi ACM Journal on Emerging Technologies in Computing Systems (JETC) 11 (2), 1-14, 2014 | 39 | 2014 |
| Measurement and evaluation of power analysis attacks on asynchronous S-box J Wu, Y Shi, M Choi IEEE Transactions on Instrumentation and Measurement 61 (10), 2765-2775, 2012 | 39 | 2012 |
| Quantization of fully convolutional networks for accurate biomedical image segmentation X Xu, Q Lu, L Yang, S Hu, D Chen, Y Hu, Y Shi Proceedings of the IEEE conference on computer vision and pattern …, 2018 | 37 | 2018 |
| On the preconditioner of conjugate gradient method—A power grid simulation perspective CH Chou, NY Tsai, H Yu, CR Lee, Y Shi, SC Chang 2011 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 494-497, 2011 | 34 | 2011 |
| Quickyield: An efficient global-search based parametric yield estimation with performance constraints F Gong, H Yu, Y Shi, D Kim, J Ren, L He Proceedings of the 47th Design Automation Conference, 392-397, 2010 | 34 | 2010 |
| Demand-side management of domestic electric water heaters using approximate dynamic programming K Al-Jabery, Z Xu, W Yu, DC Wunsch, J Xiong, Y Shi IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2016 | 33 | 2016 |
| Variability-aware parametric yield estimation for analog/mixed-signal circuits: concepts, algorithms, and challenges F Gong, Y Shi, H Yu, L He IEEE Design & Test 31 (4), 6-15, 2014 | 32 | 2014 |
| Efficient decoupling capacitance budgeting considering operation and process variations Y Shi, J Xiong, C Liu, L He IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2008 | 26 | 2008 |
| Fast analysis of structured power grid by triangularization based structure preserving model order reduction H Yu, Y Shi, L He Proceedings of the 43rd annual Design Automation Conference, 205-210, 2006 | 26 | 2006 |
| Accuracy vs. efficiency: Achieving both through fpga-implementation aware neural architecture search W Jiang, X Zhang, EHM Sha, L Yang, Q Zhuge, Y Shi, J Hu Proceedings of the 56th Annual Design Automation Conference 2019, 1-6, 2019 | 25 | 2019 |
| Efficient location identification of multiple line outages with limited PMUs in smart grids J Wu, J Xiong, Y Shi IEEE Transactions on Power Systems 30 (4), 1659-1668, 2014 | 25 | 2014 |
| Through-silicon-via inductor: Is it real or just a fantasy? UR Tida, C Zhuo, Y Shi 2014 19th Asia and South Pacific Design Automation Conference (ASP-DAC), 837-842, 2014 | 25 | 2014 |
| Through-silicon via fault-tolerant clock networks for 3-D ICs CL Lung, YS Su, HH Huang, Y Shi, SC Chang IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2013 | 24 | 2013 |
