Segui
Ganesh Subbarayan
Ganesh Subbarayan
Professor of Mechanical Engineering, Purdue University
Email verificata su purdue.edu - Home page
Titolo
Citata da
Citata da
Anno
Color printer characterization using optimization theory and neural networks
PA Drakopoulos, G Subbarayan
US Patent 6,480,299, 2002
1592002
Constitutive and aging behavior of Sn3. 0Ag0. 5Cu solder alloy
K Mysore, G Subbarayan, V Gupta, R Zhang
IEEE Transactions on Electronics Packaging Manufacturing 32 (4), 221-232, 2009
1492009
Constitutive behavior of Sn3. 8Ag0. 7Cu and Sn1. 0Ag0. 5Cu alloys at creep and low strain rate regimes
D Bhate, D Chan, G Subbarayan, TC Chiu, V Gupta, DR Edwards
IEEE Transactions on Components and Packaging Technologies 31 (3), 622-633, 2008
1252008
Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties
I Dutta, P Kumar, G Subbarayan
Jom 61, 29-38, 2009
1172009
Constructive solid analysis: a hierarchical, geometry-based meshless analysis procedure for integrated design and analysis
D Natekar, X Zhang, G Subbarayan
Computer-Aided Design 36 (5), 473-486, 2004
1162004
Estimating thermal conductivity of amorphous silica nanoparticles and nanowires using molecular dynamics simulations
SS Mahajan, G Subbarayan, BG Sammakia
Physical Review E 76 (5), 056701, 2007
812007
An evaluation of back-propagation neural networks for the optimal design of structural systems: Part I. Training procedures
L Zhang, G Subbarayan
Computer Methods in Applied Mechanics and Engineering 191 (25-26), 2873-2886, 2002
802002
A hybrid model for computationally efficient fatigue fracture simulations at microelectronic assembly interfaces
P Towashiraporn, G Subbarayan, CS Desai
International Journal of Solids and Structures 42 (15), 4468-4483, 2005
792005
An efficient network model for determining the effective thermal conductivity of particulate thermal interface materials
S Kanuparthi, G Subbarayan, T Siegmund, B Sammakia
IEEE Transactions on Components and Packaging Technologies 31 (3), 611-621, 2008
672008
Microstructurally adaptive model for primary and secondary creep of Sn-Ag-based solders
P Kumar, Z Huang, SC Chavali, DK Chan, I Dutta, G Subbarayan, V Gupta
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (2 …, 2011
612011
Reliability simulations for solder joints using stochastic finite element and artificial neural network models
G Subbarayan, Y Li, RL Mahajan
591996
High resolution characterization of materials used in packages through digital image correlation
V Srinivasan, S Radhakrishnan, X Zhang, G Subbarayan, T Baughn, ...
International Electronic Packaging Technical Conference and Exhibition 42002 …, 2005
572005
NURBS-based solutions to inverse boundary problems in droplet shape prediction
FP Renken, G Subbarayan
Computer methods in applied mechanics and engineering 190 (11-12), 1391-1406, 2000
492000
Isogeometric enriched field approximations
A Tambat, G Subbarayan
Computer Methods in Applied Mechanics and Engineering 245, 1-21, 2012
462012
CAD inspired hierarchical partition of unity constructions for NURBS‐based, meshless design, analysis and optimization
M Rayasam, V Srinivasan, G Subbarayan
International Journal for Numerical Methods in Engineering 72 (12), 1452-1489, 2007
462007
A procedure for automated shape and life prediction in flip-chip and BGA solder joints
G Subbarayan
451996
Power cycling thermal fatigue of Sn–Pb solder joints on a chip scale package
P Towashiraporn, K Gall, G Subbarayan, B McIlvanie, BC Hunter, D Love, ...
International journal of fatigue 26 (5), 497-510, 2004
442004
An evaluation of back-propagation neural networks for the optimal design of structural systems: Part II. Numerical evaluation
L Zhang, G Subbarayan
Computer Methods in Applied Mechanics and Engineering 191 (25-26), 2887-2904, 2002
432002
Thermo-elastic properties of dense YSZ and porous Ni-ZrO2 monolithic and isotropic materials
S Gadag, G Subbarayan, W Barker
Journal of materials science 41, 1221-1232, 2006
412006
Predictive reliability models through validated correlation between power cycling and thermal cycling accelerated life tests
P Towashiraporn, G Subbarayan, B McIlvanie, BC Hunter, D Love, ...
Soldering & surface mount technology 14 (3), 51-60, 2002
412002
Il sistema al momento non può eseguire l'operazione. Riprova più tardi.
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