Miguel Angel Gosalvez
TitoloCitata daAnno
Surface morphology during anisotropic wet chemical etching of crystalline silicon
MA Gosálvez, RM Nieminen
New Journal of Physics 5 (1), 100, 2003
1172003
An atomistic introduction to anisotropic etching
MA Gosálvez, K Sato, AS Foster, RM Nieminen, H Tanaka
Journal of Micromechanics and Microengineering 17 (4), S1, 2007
1142007
Study of corner compensating structures and fabrication of various shapes of MEMS structures in pure and surfactant added TMAH
P Pal, K Sato, M Shikida, MA Gosálvez
Sensors and actuators A: Physical 154 (2), 192-203, 2009
732009
Improvement in smoothness of anisotropically etched silicon surfaces: effects of surfactant and TMAH concentrations
D Cheng, MA Gosálvez, T Hori, K Sato, M Shikida
Sensors and Actuators A: Physical 125 (2), 415-421, 2006
702006
Anisotropic wet chemical etching of crystalline silicon: atomistic Monte-Carlo simulations and experiments
MA Gosalvez, RM Nieminen, P Kilpinen, E Haimi, V Lindroos
Applied surface science 178 (1-4), 7-26, 2001
662001
Orientation-and concentration-dependent surfactant adsorption on silicon in aqueous alkaline solutions: explaining the changes in the etch rate, roughness and undercutting for …
MA Gosalvez, B Tang, P Pal, K Sato, Y Kimura, K Ishibashi
Journal of Micromechanics and Microengineering 19 (12), 125011, 2009
602009
Study of rounded concave and sharp edge convex corners undercutting in CMOS compatible anisotropic etchants
P Pal, K Sato, MA Gosalvez, M Shikida
Journal of Micromechanics and Microengineering 17 (11), 2299, 2007
602007
Surfactant Adsorption on Single-Crystal Silicon Surfaces in TMAH Solution: Orientation-Dependent Adsorption Detected by In Situ Infrared Spectroscopy
P Pal, K Sato, MA Gosalvez, Y Kimura, KI Ishibashi, M Niwano, H Hida, ...
Journal of microelectromechanical systems 18 (6), 1345-1356, 2009
522009
Complex chiral colloids and surfaces via high-index off-cut silicon
KM McPeak, CD Van Engers, M Blome, JH Park, S Burger, MA Gosalvez, ...
Nano letters 14 (5), 2934-2940, 2014
502014
Atomistic simulations of surface coverage effects in anisotropic wet chemical etching of crystalline silicon
MA Gosálvez, AS Foster, RM Nieminen
Applied Surface Science 202 (3-4), 160-182, 2002
502002
Analytical solution of the continuous cellular automaton for anisotropic etching
MA Gosálvez, Y Xing, K Sato
Journal of Microelectromechanical Systems 17 (2), 410-431, 2008
462008
Ellipsometry study of the adsorbed surfactant thickness on Si {1 1 0} and Si {1 0 0} and the effect of pre-adsorbed surfactant layer on etching characteristics in TMAH
B Tang, P Pal, MA Gosalvez, M Shikida, K Sato, H Amakawa, S Itoh
Sensors and Actuators A: Physical 156 (2), 334-341, 2009
422009
Octree-based, GPU implementation of a continuous cellular automaton for the simulation of complex, evolving surfaces
N Ferrando, MA Gosalvez, J Cerdá, R Gadea, K Sato
Computer Physics Communications 182 (3), 628-640, 2011
412011
Step flow-based cellular automaton for the simulation of anisotropic etching of complex MEMS structures
Y Xing, MA Gosalvez, K Sato
New Journal of Physics 9 (12), 436, 2007
412007
Atomistic methods for the simulation of evolving surfaces
MA Gosálvez, Y Xing, K Sato, RM Nieminen
Journal of Micromechanics and Microengineering 18 (5), 055029, 2008
392008
Experimental procurement of the complete 3D etch rate distribution of Si in anisotropic etchants based on vertically micromachined wagon wheel samples
MA Gosalvez, P Pal, N Ferrando, H Hida, K Sato
Journal of Micromechanics and Microengineering 21 (12), 125007, 2011
362011
Experimental procurement of the complete 3D etch rate distribution of Si in anisotropic etchants based on vertically micromachined wagon wheel samples
MA Gosalvez, P Pal, N Ferrando, H Hida, K Sato
Journal of Micromechanics and Microengineering 21 (12), 125007, 2011
362011
Fabrication of novel microstructures based on orientation-dependent adsorption of surfactant molecules in a TMAH solution
P Pal, K Sato, MA Gosalvez, B Tang, H Hida, M Shikida
Journal of Micromechanics and Microengineering 21 (1), 015008, 2010
362010
Silicon micromachining based on surfactant-added tetramethyl ammonium hydroxide: etching mechanism and advanced applications
P Pal, MA Gosalvez, K Sato
Japanese Journal of Applied Physics 49 (5R), 056702, 2010
302010
Wet etching of silicon, Ch. 24
MA Gosálvez, I Zubel, E Viinikka
Handbook of Silicon Based MEMS Materials and Technologies, 375-407, 2010
29*2010
Il sistema al momento non può eseguire l'operazione. Riprova più tardi.
Articoli 1–20