Volgen
Ki Jin Han
Titel
Geciteerd door
Geciteerd door
Jaar
Review of near-field wireless power and communication for biomedical applications
HJ Kim, H Hirayama, S Kim, KJ Han, R Zhang, JW Choi
IEEE Access 5, 21264 - 21285, 2017
2542017
Optimal core shape design for cogging torque reduction of brushless DC motor using genetic algorithm
KJ Han, HS Cho, DH Cho, HK Jung
IEEE transactions on magnetics 36 (4), 1927-1931, 2000
1332000
Electromagnetic modeling of through-silicon via (TSV) interconnections using cylindrical modal basis functions
KJ Han, M Swaminathan, T Bandyopadhyay
Advanced Packaging, IEEE Transactions on 33 (4), 804-817, 2010
1272010
Rigorous electrical modeling of through silicon vias (TSVs) with MOS capacitance effects
T Bandyopadhyay, KJ Han, D Chung, R Chatterjee, M Swaminathan, ...
Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011
1192011
Analysis and design guide of active EMI filter in a compact package for reduction of common-mode conducted emissions
D Shin, S Kim, G Jeong, J Park, J Park, KJ Han, J Kim
Electromagnetic Compatibility, IEEE Transactions on 57 (4), 660-671, 2015
952015
Adversarial attacks and defenses on AI in medical imaging informatics: A survey
S Kaviani, KJ Han, I Sohn
Expert Systems with Applications 198, 116815, 2022
692022
Design and modeling for 3D ICs and interposers
M Swaminathan, KJ Han
World Scientific, 2013
532013
Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems
B Xie, M Swaminathan, KJ Han, J Xie
2011 IEEE International Symposium on Electromagnetic Compatibility, 16-21, 2011
432011
A design study on 40 MW synchronous motor with no-insulation HTS field winding
U Bong, SB An, J Voccio, J Kim, JT Lee, J Lee, KJ Han, H Lee, S Hahn
IEEE Transactions on Applied Superconductivity 29 (5), 5203706, 2019
402019
Cybersecurity in the AI-Based Metaverse: A Survey
M Pooyandeh, KJ Han, I Sohn
Applied Sciences 12 (24), 12993, 2022
382022
Inductance and resistance calculations in three-dimensional packaging using cylindrical conduction-mode basis functions
KJ Han, M Swaminathan
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions …, 2009
362009
Combined circuit model to simulate post-quench behaviors of no-insulation HTS coil
M Cho, S Noguchi, J Bang, J Kim, U Bong, JT Lee, SB An, KR Bhattarai, ...
IEEE Transactions on Applied Superconductivity 29 (5), 4901605, 2019
342019
Estimation of high-frequency parameters of AC machine from transmission line model
Y Ryu, BR Park, KJ Han
IEEE Transactions on Magnetics 51 (3), 8101404, 2015
322015
Design optimization for the insulation of HVDC converter transformers under composite electric stresses
M Yea, KJ Han, J Park, S Lee, J Choi
IEEE Transactions on Dielectrics and Electrical Insulation 25 (1), 253-262, 2018
252018
Modeling on-board via stubs and traces in high-speed channels for achieving higher data bandwidth
KJ Han, X Gu, YH Kwark, L Shan, MB Ritter
Components, Packaging and Manufacturing Technology, IEEE Transactions on 4 …, 2014
232014
Modeling of through-silicon via (TSV) interposer considering depletion capacitance and substrate layer thickness effects
KJ Han, M Swaminathan, J Jeong
Components, Packaging and Manufacturing Technology, IEEE Transactions on 5 …, 2015
222015
Design study on a 100-kA/20-K HTS cable for fusion magnets
S Hahn, J Song, Y Kim, KJ Han, H Lee, Y Iwasa, Y Chu
Applied Superconductivity, IEEE Transactions on 25 (3), 4801605, 2015
212015
Modeling electrical interconnections in three-dimensional structures
KJ Han, M Swaminathan
US Patent 8,352,242, 2013
212013
Electromagnetic modeling of interconnections in three-dimensional integration
KJ Han
Georgia Institute of Technology, 2009
212009
Polarization mode basis functions for modeling insulator-coated through-silicon via (TSV) interconnections
KJ Han, M Swaminathan
Signal Propagation on Interconnects, 2009. SPI'09. IEEE Workshop on, 1-4, 2009
202009
Het systeem kan de bewerking nu niet uitvoeren. Probeer het later opnieuw.
Artikelen 1–20