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philip phillipsuniversity of illinois at urbana champaignVerified email at illinois.edu
Weicheng LvUniversity of Tennessee and Oak Ridge National Laboratory Verified email at utk.edu
K.T. LawHong Kong University of Science and TechnologyVerified email at ust.hk
James Jun HEUniversity of Science and Technology of ChinaVerified email at connect.ust.hk
Antonio H. Castro NetoInstitute for Functional Intelligent Materials and Centre for Advanced 2D MaterialsVerified email at nus.edu.sg
Hui JingHuNan Normal UniversityVerified email at physics.arizona.edu
Frank KrugerUniversity College London (UCL)Verified email at ucl.ac.uk
tang qiulinUniversity of UtahVerified email at tmriusa.com
Kuei SunWashington State University Tri-CitiesVerified email at wsu.edu
Hsiang-Hsuan HungDepartment of Physics, University of Texas at AustinVerified email at physics.utexas.edu
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Jiansheng Wu
Assistant Researcher at Southern University of Science and Technology
Verified email at sustech.edu.cn