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- Hongjun YangMetaEmail verificata su meta.com
- Jung-Hun SeoUniversity at Buffalo, SUNYEmail verificata su buffalo.edu
- Deyin ZhaoUniversity of Texas at Arlington; Semerane Inc.Email verificata su uta.edu
- Munho KimAssistant Professor of EEE at Nanyang Technological UniversityEmail verificata su ntu.edu.sg
- Shanhui FanProfessor of Electrical Engineering, Stanford UniversityEmail verificata su stanford.edu
- Yi-Chen ShuaiNational Institute of Standards and TechnologyEmail verificata su nist.gov
- Shih-Chia (LEO) LiuMarvell Technology, Inc.Email verificata su mavs.uta.edu
- Mattias HammarKTH - Royal Institute of TechnologyEmail verificata su KTH.se
- Sang June ChoElectrical Engineering at UW-MadisonEmail verificata su wisc.edu
- Richard A. SorefResearch Professor of Engineering, The University of Massachusetts at BostonEmail verificata su rcn.com
- Dong LiuUniversity of Wisconsin MadisonEmail verificata su wisc.edu
- Shaoqin Sarah GongProfessor, University of Wisconsin-Madison, Dept. of Biomedical Engineering and WIDEmail verificata su engr.wisc.edu
- omar qasaimehProfEmail verificata su just.edu.jo
- Arvinder ChadhaSenior Engineering Manager, Applied MaterialsEmail verificata su mavs.uta.edu
- Xiuling LiUniversity of Texas at AustinEmail verificata su utexas.edu
- Akhil Raj Kumar KalapalaIntel CorporationEmail verificata su mavs.uta.edu
- Zhonghe LiuPhD, ZJE SemicomEmail verificata su mavs.uta.edu
- Xiaochen GeNokiaEmail verificata su nokia.com
- Meng TaoArizona State UniversityEmail verificata su asu.edu
- Yuze SunAssociate Professor, Electrical Engineering, University of Texas at ArlingtonEmail verificata su uta.edu