Po-Chun Huang
Po-Chun Huang
Department of Engineering and System Science, National Tsing Hua University
Email verificata su m99.nthu.edu.tw
Titolo
Citata da
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Anno
Improving interfacial electron transfer and light harvesting in dye-sensitized solar cells by using Ag nanowire/TiO 2 nanoparticle composite films
PC Huang, TY Chen, YL Wang, CY Wu, TL Lin
RSC advances 5 (86), 70172-70177, 2015
162015
Heterogeneous junction engineering on core–shell nanocatalysts boosts the dye-sensitized solar cell
CY Wu, YT Liu, PC Huang, TJM Luo, CH Lee, YW Yang, TC Wen, ...
Nanoscale 5 (19), 9181-9192, 2013
152013
Gold atomic clusters extracting the valence electrons to shield the carbon monoxide passivation on near-monolayer core–shell nanocatalysts in methanol oxidation reactions
TY Chen, HD Li, GW Lee, PC Huang, PW Yang, YT Liu, YF Liao, HT Jeng, ...
Physical Chemistry Chemical Physics 17 (23), 15131-15139, 2015
92015
Mesoporous TiO2 film modified with a sol–gel based interconnecting network for boosting the dye-sensitized solar cell performance
PC Huang, TY Chen, YL Wang, TL Lin
Thin solid films 570, 268-272, 2014
72014
Oxidation triggered atomic restructures enhancing the electrooxidation activities of carbon supported platinum–ruthenium catalysts
PC Huang, HS Chen, YT Liu, IL Chen, SY Huang, HM Nguyen, KW Wang, ...
CrystEngComm 16 (43), 10066-10079, 2014
72014
Shell thickness effects on reconfiguration of NiO core–Pt shell anodic catalysts in a high current density direct methanol fuel cell
TY Chen, PC Huang, YF Liao, YT Liu, TK Yeh, TL Lin
RSC Advances 6 (76), 72607-72615, 2016
42016
Panel-Level Fan-Out RDL-first Packaging for Heterogeneous Integration
JH Lau, CT Ko, KM Yang, CY Peng, T Xia, PB Lin, JJ Chen, PC Huang, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020
12020
Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration
JH Lau, CT Ko, CY Peng, KM Yang, T Xia, PB Lin, JJ Chen, PC Huang, ...
Journal of Microelectronics and Electronic Packaging 17 (3), 89-98, 2020
2020
Fan-Out RDL-first Panel-Level Packaging for Heterogeneous Integration
JH Lau, CT Ko, KM Yang, CY Peng, T Xia, PB Lin, JJ Chen, PC Huang, ...
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 339-347, 2020
2020
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