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- David A MullerProfessor of Applied and Engineering Physics, Cornell UniversityEmail verificata su cornell.edu
- James C. HoneDepartment of Mechanical Engineering, Columbia UniversityEmail verificata su columbia.edu
- Daniel A. ChenetColumbia UniversityEmail verificata su columbia.edu
- Gwan-Hyoung LeeProfessor, Materials Science and Engineering, Seoul National UniversityEmail verificata su snu.ac.kr
- Paul McEuenProfessor of Physics, Cornell UniversityEmail verificata su cornell.edu
- Jiwoong ParkUniversity of ChicagoEmail verificata su uchicago.edu
- Kenji WatanabeNational Institute for Materials ScienceEmail verificata su nims.go.jp
- Lei WangColumbia UniversityEmail verificata su columbia.edu
- Lola BrownCornell UniversityEmail verificata su cornell.edu
- Tony F HeinzDepts. of Applied Physics, Photon Science, and, by courtesy, of Electrical Eng., SLAC, StanfordEmail verificata su stanford.edu
- Philip KimHarvard UniversityEmail verificata su g.harvard.edu
- Mark LevendorfHRLEmail verificata su hrl.com
- Robert HovdenUniversity of MichiganEmail verificata su cornell.edu
- Carlos S. Ruiz-VargasVoltaLabs.comEmail verificata su cornell.edu
- Joshua W. KevekLab Manager/Fault Isolation Engineer, IntelEmail verificata su cornell.edu
- T.TaniguchiNational Institute for Materials ScienceEmail verificata su nims.go.jp
- Cheol-Joo KimDepartment of Chemical Engineering, Pohang University of Science and TechnologyEmail verificata su cornell.edu
- Inanc MericIntel Co.Email verificata su intel.com
- Cory R. DeanColumbia UnviersityEmail verificata su phys.columbia.edu
- Kenneth ShepardLau Family Professor of Electrical Engineering and Professor of Biomedical Engineering, ColumbiaEmail verificata su ee.columbia.edu
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Pinshane Y. Huang
Associate Professor of Materials Science, University of Illinois
Email verificata su illinois.edu - Home page