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- Kang L. WangElectrical Engineering DepartmentEmail verificata su ee.ucla.edu
- Xufeng KouShanghaiTech UniversityEmail verificata su shanghaitech.edu.cn
- Yabin FanWestern Digital/MIT/UCLAEmail verificata su wdc.com
- Liang HeProfessor, Nanjing University, ChinaEmail verificata su nju.edu.cn
- Jiang WanjunDepartment of Physics, Tsinghua UniversityEmail verificata su tsinghua.edu.cn
- Guoqiang YuInstitute of Physics, Chinese Academy of SciencesEmail verificata su iphy.ac.cn
- Faxian XiuPhysics Department, Fudan UniversityEmail verificata su fudan.edu.cn
- lj Chen新竹清華大學材料科學工程教授Email verificata su mx.nthu.edu.tw
- Qing CaoUniversity of Illinois at Urbana ChampaignEmail verificata su illinois.edu
- Caifu ZengUniversity of California, Los AngelesEmail verificata su ucla.edu
- Xu GuangyuAssociate Professor, UMass AmherstEmail verificata su umass.edu
- Richard KanerUniversity of California, Los AngelesEmail verificata su chem.ucla.edu
- Xiangfeng DuanUniversity of California, Los AngelesEmail verificata su chem.ucla.edu
- Chiu-Yen Wang (王秋燕)Department of Materials Science and Engineering, National Taiwan University of Science andEmail verificata su mail.ntust.edu.tw
- Jerry TersoffIBMEmail verificata su us.ibm.com
- Aaron FranklinAddy Professor of Electrical & Computer Engineering, Duke UniversityEmail verificata su duke.edu
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Jianshi Tang
Tsinghua University / IBM Research / UCLA
Email verificata su tsinghua.edu.cn - Home page