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- Liancheng WangCollege of Mechanical and Electrical Engineering, Central South University, Changsha Hunan, ChinaEmail verificata su semi.ac.cn
- Hongwei ZhuTsinghua UniversityEmail verificata su tsinghua.edu.cn
- Manijeh RazeghiNorthwestern UniversityEmail verificata su eecs.northwestern.edu
- Arash DehzangiAssistant Professor at Northwestern UniversityEmail verificata su northwestern.edu
- Hongjian LiSolid State Lighting & Energy Electronics Center, UCSBEmail verificata su ucsb.edu
- Panpan LiUniversity of California, Santa BarbaraEmail verificata su ucsb.edu
- Hoi Wai ChoiProfessor, Electrical and Electronic Engineering, The University of Hong KongEmail verificata su hku.hk
- Abbas HaddadiResearch Assistant Professor at Northwestern UniversityEmail verificata su u.northwestern.edu
- Romain ChevallierNorthwestern UniversityEmail verificata su u.northwestern.edu
- Lining LiuInstitute of Semiconductors, Chinese Academy of SciencesEmail verificata su semi.ac.cn
- Zi-Hui ZhangProfessor, Hebei University of TechnologyEmail verificata su hebut.edu.cn
- liu zhiqiangInstitute of Semiconductors, Chinese Academy of SciencesEmail verificata su semi.ac.cn
- Jianlong XuInstitute of Functional Nano & Soft Materials, Soochow UniversityEmail verificata su suda.edu.cn
- Jian-An HuangAssistant Professor, Academy Research Fellow, and Group Leader, University of OuluEmail verificata su oulu.fi
- Donghai WuInstitute of Semiconductor, CASEmail verificata su semi.ac.cn
Segui
Yiyun Zhang
Institute of Semiconcutors, Chinese Academy of Sciences
Email verificata su semi.ac.cn