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- Xue FengTsinghua UniversityEmail verificata su tsinghua.edu.cn
- Xufei Fang, Dr. -Ing.ERC-StG Group Leader@KIT; Assoc. Prof. (guest)@Osaka Uni.Email verificata su kit.edu
- Yihao ChenCenter for Flexible Electronics Technology,Tsinghua UniversityEmail verificata su mails.tsinghua.edu.cn
- Ying ChenInstitute of Flexible Electronics Technology of THU, ZhejiangEmail verificata su ifet-tsinghua.org
- Xiaoyan LiProfessor, Department of Engineering Mechanics, Tsinghua UniversityEmail verificata su tsinghua.edu.cn
- Hui WuTsinghua UniversityEmail verificata su mail.tsinghua.edu.cn
- Xuan ZhangPeking UniversityEmail verificata su pku.edu.cn
- Yinji MaResearch Associate Professor at Tsinghua UniversityEmail verificata su tsinghua.edu.cn
- Atsutomo NakamuraOsaka UniversityEmail verificata su osaka-u.ac.jp
- Qingmin Yu (Q.M. Yu)Northwestern Polytechnical UniversityEmail verificata su nwpu.edu.cn
- Chong HeThe Hong Kong Polytechnic UniversityEmail verificata su connect.polyu.hk
- Haimin YaoThe Hong Kong Polytechnic UniversityEmail verificata su polyu.edu.hk
- Xinghua ShiNational Center for Nanoscience and Technology, Chinese Academy of SciencesEmail verificata su nanoctr.cn
- Siyuan ZhangMax-Planck-Institut für Eisenforschung GmbHEmail verificata su mpie.de
- Ting ZhuGeorgia Institute of TechnologyEmail verificata su me.gatech.edu
- Huajian GaoXinghua University Professor, Tsinghua University
- Jian WuTsinghua UniversityEmail verificata su mail.tsinghua.edu.cn