| Self-assembled highly ordered acid layers in precisely sulfonated polyethylene produce efficient proton transport EB Trigg, TW Gaines, M Maréchal, DE Moed, P Rannou, KB Wagener, ... Nature materials 17 (8), 725-731, 2018 | 202 | 2018 |
| High melting precision sulfone polyethylenes synthesized by ADMET chemistry TW Gaines, EB Trigg, KI Winey, KB Wagener Macromolecular Chemistry and Physics 217 (21), 2351-2359, 2016 | 37 | 2016 |
| Functional α, ω-dienes via thiol-Michael chemistry: synthesis, oxidative protection, acyclic diene metathesis (ADMET) polymerization and radical thiol–ene modification JA van Hensbergen, TW Gaines, KB Wagener, RP Burford, AB Lowe Polymer Chemistry 5 (21), 6225-6235, 2014 | 27 | 2014 |
| Precise sulfite functionalization of polyolefins via ADMET polymerization TW Gaines, T Nakano, Y Chujo, EB Trigg, KI Winey, KB Wagener ACS Macro Letters 4 (6), 624-627, 2015 | 25 | 2015 |
| Precision sulfonic acid polyolefins via heterogenous to homogenous deprotection TW Gaines, MH Bell, EB Trigg, KI Winey, KB Wagener Macromolecular Chemistry and Physics 219 (11), 1700634, 2018 | 18 | 2018 |
| Microwave-assisted ADMET polymerization TW Gaines, KR Williams, KB Wagener, G Rojas Tetrahedron Letters 56 (25), 3923-3927, 2015 | 11 | 2015 |
| Aliphatic polysulfones with improved mechanical integrity KB Wagener, TW Gaines, M Bell US Patent 10,894,864, 2021 | 3 | 2021 |
| Bicontinuous porous ceramic composite for semiconductor package applications T Gaines, M Mamodia, P Start, K Hackenberg US Patent App. 15/859,483, 2019 | 3 | 2019 |
| Conductive adhesive layer for semiconductor devices and packages T Gaines, AM Prakash, S Ramalingam, B Liu, M Gupta, Z Belman, ... US Patent App. 15/396,415, 2018 | 3 | 2018 |
| Micro-electronic package with barrier structure W Warren, T Gaines, F Atadana, E Cetegen, V Mehta, HY Li, Y Wei, Y Guo, ... US Patent App. 16/022,528, 2020 | 2 | 2020 |
| Component coupling via plurality of adhesive elements T Gaines, M Saltas, A Eitan US Patent App. 15/859,318, 2019 | 2 | 2019 |
| Shielding for semiconductor optoelectronic devices and packages T Gaines, AM Prakash, Z Belman, B Schiffmann, A Hirshberg, ... US Patent App. 15/434,919, 2018 | 2 | 2018 |
| Sulfonated polyethylene TW Gaines, KB Wagener US Patent 9,724,686, 2017 | 2 | 2017 |
| ADMET: Functionalized Polyolefins TW Gaines, KR Williams, KB Wagener Petrochemical catalyst materials, processes, and emerging technologies, 1-21, 2016 | 2 | 2016 |
| Integrated circuit package lids with polymer features E Bozorg-Grayeli, TW Gaines, FW Atadana, SAC Arguedas, RF Cheney US Patent 11,935,799, 2024 | 1 | 2024 |
| Carbon based polymer thermal interface materials with polymer chain to carbon based fill particle bonds MET Ferrari, T Gaines, E Bozorg-Grayeli, JC Matayabas Jr US Patent 11,881,440, 2024 | 1 | 2024 |
| Layer for etched identification marks on a package T Gaines, K Hirota, Y Tomita, J Yao US Patent App. 16/436,576, 2020 | 1 | 2020 |
| Underfill flow management in electronic assemblies FW Atadana, TW Gaines, E Cetegen, W Li, HY Li, T Dambrauskas US Patent 11,935,861, 2024 | | 2024 |
| IC assemblies including die perimeter frames suitable for containing thermal interface materials K Arrington, F Atadana, T Gaines, M Ha US Patent 11,842,944, 2023 | | 2023 |
| Microelectronic package with underfilled sealant TW Gaines, K Hackenberg, FW Atadana, E Bozorg-Grayeli US Patent 11,710,672, 2023 | | 2023 |
