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- Daniele IelminiProfessor of ElectronicsEmail verificata su elet.polimi.it
- Elia AmbrosiTSMCEmail verificata su tsmc.com
- Guangwei XuUniversity of Science and Technology of ChinaEmail verificata su ustc.edu.cn
- Erika CoviZernike Institute for Advanced Materials & CogniGron Center, University of GroningenEmail verificata su rug.nl
- Alessandro BricalliPolitecnico di MilanoEmail verificata su polimi.it
- Giacomo PedrettiResearch Scientist, Hewlett Packard LaboratoriesEmail verificata su hpe.com
- Yang LiPeng Cheng LaboratoryEmail verificata su pcl.ac.cn
- Dr. Lingfei WangProfessor,Researcher, Institute of Microelectronics, Chinese Academy of Sciences, ChinaEmail verificata su ime.ac.cn
- Zhong SunPeking UniversityEmail verificata su pku.edu.cn
- Ming WangAssociate Professor, Fudan UniversityEmail verificata su fudan.edu.cn
- Mario LaudatoWestern DigitalEmail verificata su wdc.com
- Yu-Hsuan LinMacronix International Co., LTD.Email verificata su nctu.edu.tw
- Valerio MiloApplied MaterialsEmail verificata su amat.com
- Shahar KvatinskyTechnion - Israel Institute of TechnologyEmail verificata su ee.technion.ac.il
- Xumeng ZhangFrontier Institute of Chip and System, Fudan UniversityEmail verificata su fudan.edu.cn
- Xiaodong Chen(陈晓东)President's Chair Professor in Materials Science and Engineering, Nanyang Technological UniversityEmail verificata su ntu.edu.sg
- Matteo FarronatoPostdoctoral researcher, Politecnico di MilanoEmail verificata su polimi.it
- Roberto CarboniIntel CorporationEmail verificata su intel.com
- Zhongrui WangThe University of Hong KongEmail verificata su eee.hku.hk
- Linfeng SUNProfessor, Beijing Institute of TechnologyEmail verificata su bit.edu.cn