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G J ShifletProfessor of Materials Science, University of VirginiaEmail verificata su virginia.edu
Terry TrittProfessor of Physics, Clemson UniversityEmail verificata su g.clemson.edu
Takeshi EgamiProfessor of Materials Science and Physics, University of TennesseeEmail verificata su utk.edu
William L. JohnsonCalifornia Institute of TechnologyEmail verificata su caltech.edu
Jack SimonsonFarmingdale State CollegeEmail verificata su farmingdale.edu
SA WolfUniversity of VirginiaEmail verificata su virginia.edu
Wenjie XieTechnische Universität DarmstadtEmail verificata su mr.tu-darmstadt.de
Despina LoucaProfessor of Physics, University of VirginiaEmail verificata su virginia.edu
J GopalakrishnanSolid State and structural Chemistry Unit, Indian Institute of Science, Bangalore, IndiaEmail verificata su iisc.ac.in
Jian HeClemson UniversityEmail verificata su clemson.edu
Di WuShaanxi Normal University/Southern University of Science and Technology/University of VirginiaEmail verificata su snnu.edu.cn
Eugene ChenSamsung, Grandis, Cypress Semiconductor, Motorola, NVEEmail verificata su samsung.com
Mircea R. StanVirginia Microelectronics Consortium (VMEC) Professor, University of VirginiaEmail verificata su virginia.edu
Xinfeng Tang (唐新峰)Wuhan University of TechnologyEmail verificata su whut.edu.cn
Dmytro ApalkovPrincipal Engineer/Director, Modeling, Samsung Semiconductor R&DEmail verificata su samsung.com
anke weidenkaffTU DarmstadtEmail verificata su mr.tu-darmstadt.de
Rama VenkatasubramanianJohns Hopkins University Applied Physics LabEmail verificata su jhuapl.edu
Jiwei LuAFOSR
S. Joseph Poon
Email verificata su virginia.edu