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- James T. TeheraniGaN Device Development and Process Integration Engineer, Texas InstrumentsEmail verificata su ti.com
- Min Sup ChoiDepartment of Materials Science and Engineering, Chungnam National UniversityEmail verificata su cnu.ac.kr
- James C. HoneDepartment of Mechanical Engineering, Columbia UniversityEmail verificata su columbia.edu
- Abhinandan BorahNavitas SemiconductorEmail verificata su navitassemi.com
- Won Jong YooProfessor of Sungkyunkwan UniversityEmail verificata su skku.edu
- Naveen kaushikMicron TechnologyEmail verificata su micron.com
- Saurabh LodhaProfessor, Electrical Engineering, IIT BombayEmail verificata su ee.iitb.ac.in
- Younghun JungColumbia University, Postdoctoral Research ScientistEmail verificata su columbia.edu
- Mandar M. DeshmukhCondensed Matter Physics and Materials Science, TIFR, Mumbai 400005 IndiaEmail verificata su tifr.res.in
- Maya Narayanan NairResearch Assistant Professor, CUNY Advanced Science Research CenterEmail verificata su gc.cuny.edu
- Abhay PasupathyProfessor of Physics, Columbia University and Group Leader, Brookhaven National LaboratoryEmail verificata su columbia.edu
- Ioannis KymissisKenneth Brayer Professor of Electrical Engineering, Columbia UniversityEmail verificata su columbia.edu
- Ipshita DattaUrbanek-Chodorow Fellow, Stanford UniversityEmail verificata su columbia.edu
- Michal LipsonEmail verificata su columbia.edu
- Zachary A LamportSenior Scientist, ExponentEmail verificata su exponent.com
- Xiaoyang ZhuHoward Family Professor of Nanoscience, Columbia UniversityEmail verificata su columbia.edu
- P. James SchuckColumbia UniversityEmail verificata su columbia.edu
- Alexander KerelskyGoogleEmail verificata su google.com
- Daniel RhodesUniversity of Wisconsin - MadisonEmail verificata su wisc.edu
- Apoorv JindalPrinceton UniversityEmail verificata su princeton.edu