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- Sheikh Nijam AliQualcomm Inc.Email verificata su qti.qualcomm.com
- Pawan AgarwalMaxlinear IncEmail verificata su eecs.wsu.edu
- Joe BaylonHardware Engineer, Schweitzer Engineering LaboratoriesEmail verificata su selinc.com
- Partha PandeWashington State UniversityEmail verificata su wsu.edu
- Luke RenaudEmail verificata su eecs.wsu.edu
- Md Aminul HoqueRenesas Electronics AmericaEmail verificata su wsu.edu
- Mohammad chahardoriWashington State UniversityEmail verificata su wsu.edu
- Mohammad Ali MokriSchool of Electrical Engineering and Computer Science, Washington State UniversityEmail verificata su wsu.edu
- Shahriar MirabbasiUniversity of British ColumbiaEmail verificata su ece.ubc.ca
- Jainaveen SundaramResearch ScientistEmail verificata su intel.com
- Reza MolaviGoogle Research/University of British ColumbiaEmail verificata su ece.ubc.ca
- Xinmin YuQualcomm Inc.Email verificata su eecs.wsu.edu
- Janardhan Rao (Jana) DoppaHuie-Rogers Endowed Chair Associate Professor, Washington State UniversityEmail verificata su eecs.wsu.edu
- Aqeeb Iqbal ArkaGraphics Hardware Engineer @ Intel CorporationEmail verificata su intel.com
- Edward BurtonSenior Principal Engineer, Intel CorporationEmail verificata su intel.com
- Thomas JohnsonAssociate Professor, School of Engineering, University of British ColumbiaEmail verificata su ubc.ca
- Sourav DasIntel CorporationEmail verificata su intel.com