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- Congcong WangPh.D student of Materials Science, University of RochesterEmail verificata su ur.rochester.edu
- Irfan AhmadCoordinator at Alien Tech Transfer; PhD Physics Uo Rochester; Ex Scientist SF Bay AreaEmail verificata su pas.rochester.edu
- Qifan YanEast China University of Science and TechnologyEmail verificata su ecust.edu.cn
- Julia ReinspachStanford UniversityEmail verificata su stanford.edu
- Harald AdeGoodnight Innovation Dist. Prof., North Carolina State UniversityEmail verificata su ncsu.edu
- Holloway PHDistinguished ProfessorEmail verificata su mse.ufl.edu
- Krishna AcharyaSavannah River National LaboratoryEmail verificata su srnl.doe.gov
- Marc RamuzEcole Nationale Supérieure des Mines de Saint-Etienne, CMPEmail verificata su emse.fr
- Yingpeng Wu美国斯坦福大学化学系Email verificata su stanford.edu
- Yi CuiStanford UniversityEmail verificata su stanford.edu
- Lu Lyu (Lu Lv, 吕路)Technische Universität KaiserslauternEmail verificata su rhrk.uni-kl.de
- Wei Xia, Ph.D.Samsung Austin Semiconductor; University of Rochester; Chinese Academy of Sciences;Email verificata su samsung.com
- Xing Sheng (盛兴)Electronic Engineering, Tsinghua UniversityEmail verificata su tsinghua.edu.cn
- Ching W. TangInstitute for Advanced Study, Hong Kong University of Science and TechnologyEmail verificata su rochester.edu
- Cong FuTUV SUD
- Lai WangDepartment of Electronic Engineering, Tsinghua University, 100084 Beijing, ChinaEmail verificata su tsinghua.edu.cn