A simple method for quality evaluation of micro-optical components based on 3D IPSF measurement M Baranski, S Perrin, N Passilly, L Froehly, J Albero, S Bargiel, C Gorecki
Optics express 22 (11), 13202-13212, 2014
34 2014 Dense arrays of millimeter-sized glass lenses fabricated at wafer-level J Albero, S Perrin, S Bargiel, N Passilly, M Baranski, L Gauthier-Manuel, ...
Optics express 23 (9), 11702-11712, 2015
30 2015 Wafer-level fabrication of microcube-typed beam-splitters by saw-dicing of glass substrate M Baranski, S Bargiel, N Passilly, B Guichardaz, E Herth, C Gorecki, C Jia, ...
IEEE Photonics Technology Letters 26 (1), 100-103, 2014
17 2014 A numerical model of wet isotropic etching of silicon molds for microlenses fabrication M Baranski, J Albero, R Kasztelanic, C Gorecki
Journal of The Electrochemical Society 158 (11), D681-D688, 2011
16 2011 MEMS Tunable Diffraction Grating for Spaceborne Imaging Spectroscopic Applications SS Muttikulangara, M Baranski, S Rehman, L Hu, J Miao
Sensors 17 (10), 2372, 2017
15 2017 Swept source optical coherence tomography endomicroscope based on vertically integrated Mirau micro interferometer: concept and technology P Struk, S Bargiel, L Froehly, M Baranski, N Passilly, J Albero, C Gorecki
IEEE, 2015
15 2015 Micro-optical design of a three-dimensional microlens scanner for vertically integrated micro-opto-electro-mechanical systems M Baranski, S Bargiel, N Passilly, C Gorecki, C Jia, J Frömel, M Wiemer
Applied Optics 54 (22), 6924-6934, 2015
14 2015 Microfabrication of axicons by glass blowing at a wafer-level JV Carrión, J Albero, M Baranski, C Gorecki, N Passilly
Optics letters 44 (13), 3282-3285, 2019
13 2019 3D micro-optical lens scanner made by multi-wafer bonding technology S Bargiel, C Gorecki, M Barański, N Passilly, M Wiemer, C Jia, J Froemel
MOEMS and Miniaturized Systems XII 8616, 861605, 2013
13 2013 Vertical integration technologies for optical transmissive 3-D microscanner based on glass microlenses S Bargiel, C Jia, M Barański, J Frömel, N Passilly, C Gorecki, M Wiemer
Procedia Engineering 47, 1133-1136, 2012
9 2012 Impact of mirror spider legs on imaging quality in Mirau micro-interferometry J Lullin, S Perrin, M Baranski, S Bargiel, L Froehly, N Passilly, J Albero, ...
Optics Letters 40 (10), 2209-2212, 2015
8 2015 Deep Wet-Etched Silicon Cavities for Micro-Optical Sensors: Influence of Masking on Sidewalls Surface Quality R Chutani, N Passilly, J Albero, M Baranski, C Gorecki
Microelectromechanical Systems, Journal of 23 (3), 585-591, 2014
8 2014 Computational integral field spectroscopy with diverse imaging M Baranski, S Rehman, SS Muttikulangara, G Barbastathis, J Miao
JOSA A 34 (9), 1711-1719, 2017
7 2017 Fabrication of 100% fill factor arrays of microlenses from silicon molds M Baranski, N Passilly, J Albero, C Gorecki
SPIE Photonics Europe, 84281G-84281G-7, 2012
7 2012 Miniature Schwarzschild objective as a micro-optical component free of main aberrations: concept, design, and first realization with silicon-glass micromachining M Baranski, N Passilly, S Bargiel, L Froehly, C Gorecki
Applied Optics 55 (10), 2771-2779, 2016
5 2016 Simple method based on intensity measurements for characterization of aberrations from micro-optical components S Perrin, M Baranski, L Froehly, J Albero, N Passilly, C Gorecki
Applied optics 54 (31), 9060-9064, 2015
5 2015 Monolithic integration of a glass membrane on silicon micro-actuator for micro-interferometry J Lullin, S Bargiel, E Courjon, S Perrin, M Baranski, N Passilly, C Gorecki
Optical MEMS and Nanophotonics (OMN), 2014 International Conference on, 87-88, 2014
5 2014 Multi-wafer bonding, stacking and interconnecting of integrated 3-D MEMS micro scanners M Wiemer, D Wünsch, J Frömel, T Gessner, S Bargiel, M Barański, ...
International Journal of Microwave & Optical Technology 9 (1), 128-133, 2014
5 2014 Diffraction grating integrated on micromachined stepper motor for diversity implementation in imaging spectroscopy SS Muttikulangara, M Baranski, S Rehman, L Hu, J Miao
Micro Electro Mechanical Systems (MEMS), 2018 IEEE, 696-699, 2018
4 2018 Technological platform for vertical multi-wafer integration of miniature imaging instruments S Bargiel, M Baranski, N Passilly, C Gorecki, M Wiemer, J Frömel, ...
MOEMS and Miniaturized Systems XIV 9375, 93750L, 2015
4 2015