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- Min Sup ChoiDepartment of Materials Science and Engineering, Chungnam National UniversityEmail verificata su cnu.ac.kr
- Daeyeong LeeSamsumg ElectronicsEmail verificata su samsung.com
- James C. HoneDepartment of Mechanical Engineering, Columbia UniversityEmail verificata su columbia.edu
- Xiaochi Liu 刘晓迟School of Physics and Electronics, Central South UniversityEmail verificata su csu.edu.cn
- Deshun QuPh.D, SAINT, Sungkyunkwan UniversityEmail verificata su skku.edu
- Inyong MoonSungkyunkwan UniversityEmail verificata su skku.edu
- Huamin LiAssistant Professor, University at BuffaloEmail verificata su buffalo.edu
- Kenji WatanabeNational Institute for Materials ScienceEmail verificata su nims.go.jp
- Changsik KimSKKU Advanced Institute of Nano Technology, Sungkyunkwan UniversityEmail verificata su skku.edu
- Zheng YangKing Abdullah University of Science and TechnologyEmail verificata su kaust.edu.sa
- E. H. HwangSungKyunKwan UniversityEmail verificata su skku.edu
- Ganesh SamudraAssociate Professor, National University of SingaporeEmail verificata su nus.edu.sg
- Wan Sik HwangKorea Aerospace UniversityEmail verificata su kau.ac.kr
- Changgu LeeSungkyunkwan UniversityEmail verificata su skku.edu
- Yee-Chia YeoNational University of SingaporeEmail verificata su nus.edu.sg
- T.TaniguchiNational Institute for Materials ScienceEmail verificata su nims.go.jp
- James T. TeheraniGaN Device Development and Process Integration Engineer, Texas InstrumentsEmail verificata su ti.com
- Tien Dat NgoimecEmail verificata su imec.be
- Albert ChinNational Yang Ming Chiao Tung UniversityEmail verificata su nycu.edu.tw
- Ankur NipaneIntel CorporationEmail verificata su intel.com