| On the study of piezoresistive stress sensors for microelectronic packaging BJ Lwo, CH Kao, TS Chen, YS Chen J. Electron. Packag. 124 (1), 22-26, 2002 | 27 | 2002 |
| Large-Area Laying of Soft Textile Power Generators for the Realization of Body Heat Harvesting Clothing YS Chen, BJ Lwo coatings 9 (12), 8, 2019 | 15 | 2019 |
| Method for improving a high-speed edge-coupled photodetector CL Ho, GC Lin, IM Liu, CJ Lin, YS Chen, WJ Ho, JW Liaw US Patent 6,808,957, 2004 | 8 | 2004 |
| Measuring Seebeck coefficient on thin film thermoelectric materials without metallization treatment YS Chen, SJ Lin, BJ Lwo 2015 10th International Microsystems, Packaging, Assembly and Circuits …, 2015 | 4 | 2015 |
| Flexible Thermoelectric Films by Electrospinning YS Chen, BJ Lwo 2020 15th International Microsystems, Packaging, Assembly and Circuits …, 2020 | 2 | 2020 |
| A seebeck coefficient extraction methodology for thin film thermoelectric devices with different substrates YS Chen, BJ Lwo 2017 12th International Microsystems, Packaging, Assembly and Circuits …, 2017 | 1 | 2017 |
| Thermoelectric Element SJ Lin, YS Chen US Patent App. 14/656,906, 2015 | | 2015 |
