| Packaging methods and structures for semiconductor devices CW Lin, MD Cheng, LU Wen-Hsiung, HJ Lin, BP Jang, CS Liu, MJ Lii, ... US Patent 8,884,431, 2014 | 634 | 2014 |
| Nanosecond electric pulse-induced calcium entry into chromaffin cells PT Vernier, Y Sun, MT Chen, MA Gundersen, GL Craviso Bioelectrochemistry 73 (1), 1-4, 2008 | 141 | 2008 |
| Nanosecond pulsed plasma dental probe C Jiang, MT Chen, A Gorur, C Schaudinn, DE Jaramillo, JW Costerton, ... Plasma Processes and Polymers 6 (8), 479-483, 2009 | 129 | 2009 |
| Pulsed Atmospheric-Pressure Cold Plasma for Endodontic Disinfection C Jiang, MT Chen, C Schaudinn, A Gorur, PT Vernier, JW Costerton, ... IEEE Transactions on Plasma Science 37 (7), 1190-1195, 2009 | 111 | 2009 |
| Polarity-induced asymmetric effects of nanosecond pulsed plasma jets C Jiang, MT Chen, MA Gundersen Journal of Physics D: Applied Physics 42 (23), 232002, 2009 | 97 | 2009 |
| Cardiac myocyte excitation by ultrashort high-field pulses S Wang, J Chen, MT Chen, PT Vernier, MA Gundersen, M Valderrábano Biophysical journal 96 (4), 1640-1648, 2009 | 87 | 2009 |
| Packaging Methods and Packaged Semiconductor Devices MT Chen, WH Lin, YP Tsai, CC Lin, CW Lin, MD Cheng, CS Liu US Patent App. 13/416,805, 2013 | 84 | 2013 |
| Two-dimensional nanosecond electric field mapping based on cell electropermeabilization MT Chen, C Jiang, PT Vernier, YH Wu, MA Gundersen PMC biophysics 2, 1-16, 2009 | 75 | 2009 |
| Process for forming package-on-package structures CW Lin, MD Cheng, MT Chen, LU Wen-Hsiung, KW Huang, CS Liu US Patent 8,975,741, 2015 | 65 | 2015 |
| Package-on-package structure including a thermal isolation material and method of forming the same MT Chen, KW Huang, TT Tsai, AT Ang, MD Cheng, CS Liu US Patent 9,418,971, 2016 | 59 | 2016 |
| Warpage control in a package-on-package structure MT Chen, WH Lin, KW Huang, TT Tsai, AT Ang, MD Cheng, CS Liu US Patent 8,846,448, 2014 | 40 | 2014 |
| Sequential administration of carbon nanotubes and near-infrared radiation for the treatment of gliomas T Santos, X Fang, MT Chen, W Wang, R Ferreira, N Jhaveri, M Gundersen, ... Frontiers in oncology 4, 180, 2014 | 34 | 2014 |
| Package-on-package structure having polymer-based material for warpage control MT Chen, YC Liu, H Huang, WH Lin, JR Lu, MD Cheng, CS Liu US Patent 9,349,663, 2016 | 29 | 2016 |
| RDL-first packaging process CW Lin, SC Chen, MT Chen, MD Cheng, CS Liu US Patent 9,425,178, 2016 | 26 | 2016 |
| Package on package structures and methods for forming the same CH Yu, MJ Lii, CS Liu, MT Chen, WH Lin, MD Cheng US Patent 9,219,030, 2015 | 26 | 2015 |
| Device package with reduced thickness and method for forming same CH Yu, MT Chen, MD Cheng, CS Liu US Patent 9,786,631, 2017 | 25 | 2017 |
| Apparatus and methods for molded underfills in flip chip packaging MT Chen, HJ Lin, CC Lin, LU Wen-Hsiung, MD Cheng, CS Liu US Patent 9,412,717, 2016 | 23 | 2016 |
| 3D package structure and methods of forming same MT Chen, CS Liu, CW Lin, H Huang, HT Kuo, MD Cheng US Patent 10,276,541, 2019 | 22 | 2019 |
| Package structure and method for forming the same YP Tsai, SF Weng, SH Chiu, MT Chen, CW Lin, WH Lin, MD Cheng, ... US Patent 9,859,229, 2018 | 22 | 2018 |
| Methods of packaging semiconductor devices and packaged semiconductor devices CH Yu, CS Liu, MT Chen, H Huang, CF Huang, MD Cheng US Patent 9,847,317, 2017 | 22 | 2017 |
P T VernierCenter for Bioelectrics, Old Dominion UniversityVerified email at odu.edu
