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- Quan PanSouthern University of Science and TechnologyEmail verificata su sustech.edu.cn
- Wing-Hung KiThe Hong Kong University of Science and TechnologyEmail verificata su ust.hk
- Yan LuAssociate Professor, University of MacauEmail verificata su umac.mo
- Salahuddin RajuScientist, Senior Member of IEEEEmail verificata su ieee.org
- Liang WuThe Chinese University of Hong Kong, ShenzhenEmail verificata su ieee.org
- Mansun ChanChair Professor, HKUSTEmail verificata su ust.hk
- Frank O'MahonyIntelEmail verificata su intel.com
- Kei May LauHong Kong University of Science & TechnologyEmail verificata su ust.hk
- Rongxiang WUAssociate Professor of Microelectronics and Solid-State Electronics, UESTCEmail verificata su uestc.edu.cn
- Mark HorowitzProfessor of Electrical Engineering and Computer ScienceEmail verificata su ee.stanford.edu
- Piljae ParkETRIEmail verificata su etri.re.kr
- H. Tom SohProfessor of Electrical Engineering and Radiology, Stanford UniversityEmail verificata su stanford.edu
- Mark J.W. RodwellProfessor of Electrical and Computer Engineering, University of California, Santa BarbaraEmail verificata su ece.ucsb.edu
- Li SunPrincipal Engineer at MarvellEmail verificata su marvell.com
- Patrick ChiangProfessor of Electrical and Computer Engineering, Fudan UniversityEmail verificata su fudan.edu.cn
- Zongyu DongQualcomm Technology IncEmail verificata su ucr.edu
- Upamanyu MadhowProfessor of Electrical and Computer Engineering, University of California, Santa BarbaraEmail verificata su ece.ucsb.edu
- James A. BainProfessor of ECE, Carnegie Mellon UniversityEmail verificata su ece.cmu.edu
- Chi Ying TsuiHong Kong University of Science and TechnologyEmail verificata su ece.ust.hk
- Philip K.T. Mok, IEEE FellowProfessor Emeritus of Dept of ECE, Hong Kong University of ScienceEmail verificata su ust.hk