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Boris Vaisband
Titolo
Citata da
Citata da
Anno
Silicon interconnect fabric: A versatile heterogeneous integration platform for AI systems
SS Iyer, S Jangam, B Vaisband
IBM Journal of Research and Development 63 (6), 5: 1-5: 16, 2019
312019
Demonstration of a Heterogeneously Integrated System-on-Wafer (SoW) Assembly
AA Bajwa, SC Jangam, S Pal, B Vaisband, R Irwin, M Goorsky, SS Iyer
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1926-1930, 2018
222018
Hexagonal TSV Bundle Topology for 3-D ICs
B Vaisband, EG Friedman
IEEE Transactions on Circuits and Systems II: Express Briefs 64 (1), 11-15, 2017
202017
3-D ICs as a Platform for Heterogeneous Systems Integration
B Vaisband
University of Rochester, 2017
192017
Thermal Conduction Path Analysis in 3-D ICs
B Vaisband, I Savidis, EG Friedman
Circuits and Systems (ISCAS), 2014 IEEE International Symposium on, 594-597, 2014
192014
Process Development of Power Delivery Through Wafer Vias for Silicon Interconnect Fabric
MH Liu, B Vaisband, A Hanna, Y Luo, Z Wan, SS Iyer
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 579-586, 2019
182019
Experimental Analysis of Thermal Coupling in 3-D Integrated Circuits
I Savidis, B Vaisband, EG Friedman
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 23 (10 …, 2015
172015
Power Noise and Near Field EMI of High Current System-in-Package with VR Top and Bottom Placement
K Xu, B Vaisband, G Sizikov, X Li, EG Friedman
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (4 …, 2019
152019
Dynamic Thermal Management Of Silicon Interconnect Fabric Using Flash Cooling
U Shah, U Mogera, P Ambhore, B Vaisband, SS Iyer, TS Fisher
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
132019
Noise Coupling Models in Heterogeneous 3-D ICs
B Vaisband, EG Friedman
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 24 (8 …, 2016
132016
PowerTherm Attach Process for Power Delivery and Heat Extraction in the Silicon-Interconnect Fabric Using Thermocompression Bonding
P Ambhore, U Mogera, B Vaisband, U Shah, T Fisher, M Goorsky, SS Iyer
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1605-1610, 2019
122019
Heterogeneous 3-D ICs as a platform for hybrid energy harvesting in IoT systems
B Vaisband, EG Friedman
Future Generation Computer Systems 87, 152-158, 2018
122018
Electrical and Thermal Models of CNT TSV and Graphite Interface
B Vaisband, A Maurice, CW Tan, BK Tay, EG Friedman
IEEE Transactions on Electron Devices 65 (5), 1880 - 1886, 2018
102018
Network on Interconnect Fabric
B Vaisband, A Bajwa, SS Iyer
Quality Electronic Design (ISQED), 2018 19th International Symposium on, 2018
92018
Power Delivery for Silicon Interconnect Fabric
Y Safari, B Vaisband
2021 IEEE International Symposium on Circuits and Systems (ISCAS), 1-5, 2021
72021
Assembly Process and Electrical Properties of Top-Transferred Graphene on Carbon Nanotubes for Carbon-Based Three-Dimensional Interconnects
Y Zhu, CW Tan, SL Chua, YD Lim, B Vaisband, BK Tay, EG Friedman, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2019
7*2019
3-D Floorplanning Algorithm to Minimize Thermal Interactions
B Vaisband, EG Friedman
Circuits and Systems (ISCAS), 2015 IEEE International Symposium on, 2133-2136, 2015
72015
CTT-Based Scalable Neuromorphic Architecture
M Karimi, AS Monir, R Mohammadrezaee, B Vaisband
IEEE Journal on Emerging and Selected Topics in Circuits and Systems 13 (1 …, 2023
62023
Multi-Bit CNT TSV for 3-D ICs
B Vaisband, A Maurice, CW Tan, BK Tay, EG Friedman
2020 IEEE International Symposium on Circuits and Systems (ISCAS), 1-5, 2020
62020
Communication Considerations for Silicon Interconnect Fabric
B Vaisband, SS Iyer
2019 ACM/IEEE International Workshop on System Level Interconnect Prediction …, 2019
62019
Il sistema al momento non può eseguire l'operazione. Riprova più tardi.
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