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Coautori
- Nelson TansuHead of School & Professor, School of Electrical & Mechanical Engineering [EEE, ME, & BME]Email verificata su adelaide.edu.au
- Hongping ZhaoProfessor of Electrical & Computer Engineering, Materials Science & Engineering, OSUEmail verificata su osu.edu
- Jing ZhangAssociate Professor, Rochester Institute of TechnologyEmail verificata su rit.edu
- Boon S. OoiKing Abdullah University of Science & Technology (KAUST)Email verificata su kaust.edu.sa
- Tien Khee NgPrincipal Scientist, KAUST; Fellow of IET, Fellow of IOPEmail verificata su kaust.edu.sa
- Xiaohang LiAssociate Professor, Advanced Semiconductor Lab, ECE, KAUST, Saudi ArabiaEmail verificata su kaust.edu.sa
- Volkmar DierolfLehigh UniversityEmail verificata su lehigh.edu
- Jonathan D. PoplawskyOak Ridge National LaboratoryEmail verificata su ornl.gov
- Ronald ArifLehigh University, II-VI, Cree, Veeco, ThermoFisherEmail verificata su thermofisher.com
- Chun Hong KangKing Abdullah University of Science and Technology (KAUST)Email verificata su kaust.edu.sa
- Chao ShenFudan UniversityEmail verificata su kaust.edu.sa
- Chee-Keong TanAssistant Professor, Hong Kong University of Science and Technology (Guangzhou)Email verificata su ust.hk
- Prof. Mohamed-Slim AlouiniWireless CT Lab, King Abdullah University of Science and Technology (KAUST), Kingdom of Saudi ArabiaEmail verificata su kaust.edu.sa
- Kang-Ting HoKAUSTEmail verificata su kaust.edu.sa
- Peifen ZhuUniversity of MissouriEmail verificata su missouri.edu
- Hassan Makine OubeiKing Abdullah University of Science and TechnologyEmail verificata su kaust.edu.sa
- Jim SpeckProfessor of Materials, UCSBEmail verificata su ucsb.edu
- Davide PrianteCoherent Corp.Email verificata su unm.edu
- Chao ZhaoProfessor, Institute of Semiconductors, Chinese Academy of Sciences; Fellow of IOPEmail verificata su semi.ac.cn
- Mohamed EbaidBerkeley LabEmail verificata su lbl.gov