| High-current drivability Fibonacci charge pump with connect–point–shift enhancement H Lin, WC Chan, WK Lee, Z Chen, M Chan, M Zhang IEEE Transactions on Very Large Scale Integration (VLSI) Systems 25 (7 …, 2017 | 18 | 2017 |
| Leakage current elimination of Dickson charge pump with a linear regulator H Lin, H Cao, Z Chen, WC Chan, WK Lee, M Zhang Microelectronics Journal, 2017 | 12 | 2017 |
| Dickson charge pump with gate drive enhancement and area saving H Lin, WC Chan, WK Lee, Z Chen, M Zhang Journal of Power electronics 16 (3), 1209-1217, 2016 | 10 | 2016 |
| A high conversion ratio component-efficient charge pump for display drivers H Lin, WC Chan, WK Lee, Z Chen, M Chan, M Zhang Journal of Display Technology 12 (10), 1057-1063, 2016 | 9 | 2016 |
| A novel linear regulator in build-in capacitor Dickson charge pump applications with low output ripple H Lin, M Zhang, WC Chan, WK Lee 2015 IEEE International Conference on Electron Devices and Solid-State …, 2015 | 8 | 2015 |
| A step-up charge pump with high integration and full-coverage voltage conversion ratio D Ding, H Lin, B Liu, M Zhang 2018 IEEE International Symposium on Circuits and Systems (ISCAS), 1-4, 2018 | 7 | 2018 |
| 3D heterogeneous package integration of air/magnetic core inductor: 89%-efficiency buck converter with backside power delivery network X Sun, H Lin, D Velenis, J Slabbekoorn, G Talmelli, P Bex, T Sterken, ... 2020 IEEE Symposium on VLSI Technology, 1-2, 2020 | 6 | 2020 |
| Backside pdn and 2.5 d mimcap to double boost 2d and 3d ics ir-drop beyond 2nm node R Chen, G Sisto, M Stucchi, A Jourdain, K Miyaguchi, P Schuddinck, ... 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and …, 2022 | 5 | 2022 |
| 84%-efficiency fully integrated voltage regulator for computing systems enabled by 2.5-D high-density MIM capacitor H Lin, D Velenis, P Nolmans, X Sun, F Catthoor, R Lauwereins, ... IEEE Transactions on Very Large Scale Integration (VLSI) Systems 30 (5), 661-665, 2022 | 5 | 2022 |
| A low-power regulator for display driver IC requiring a moderate current drivability H Lin, M Zhang, WC Chan, WK Lee 2015 IEEE International Conference on Electron Devices and Solid-State …, 2015 | 5 | 2015 |
| 91.5%-Efficiency Fully Integrated Voltage Regulator with 86fF/μm2-High-Density 2.5D MIM Capacitor H Lin, D Velenis, P Nolmans, X Sun, F Catthoor, R Lauwereins, ... 2021 Symposium on VLSI Technology, 1-2, 2021 | 4 | 2021 |
| Design of a peripheral-circuit-compensation adjustable-gamma-voltage driving chip for OLED-on-silicon microdisplay J Wen, HM Lam, C Li, D Zhang, W Zeng, H Lin, M Zhang 2019 IEEE International Conference on Electron Devices and Solid-State …, 2019 | 4 | 2019 |
| Efficient Backside Power Delivery for High-Performance Computing Systems H Lin, G Van der Plas, X Sun, D Velenis, F Catthoor, R Lauwereins, ... IEEE Transactions on Very Large Scale Integration (VLSI) Systems 30 (11 …, 2022 | 3 | 2022 |
| System optimization: High-frequency buck converter with 3-D in-package air-core inductor H Lin, G Van der Plas, X Sun, D Velenis, E Beyne, R Lauwereins IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2021 | 3 | 2021 |
| Backside power delivery with a direct 14: 1/19: 1 high-ratio point-of-load power converter for servers and datacenters H Lin, G Hiblot, X Sun, G Talmelli, D Velenis, P Bex, C Adelmann, ... 2021 Symposium on VLSI Technology, 1-2, 2021 | 3 | 2021 |
| P‐45: A Multi‐Phase, High‐Current‐Drivability Charge Pump in Display Driver ICs H Lin, D Ding, B Liu, D Zhang, J Wen, M Zhang SID Symposium Digest of Technical Papers 49 (1), 1365-1368, 2018 | 3 | 2018 |
| P‐52: A Fibonacci‐Like Charge Pump and its Current Drive Capacity Enhancement for Display Driver ICs D Ding, B Liu, T Zhou, H Lin, M Zhang SID Symposium Digest of Technical Papers 48 (1), 1434-1437, 2017 | 3 | 2017 |
| A novel Makowski charge pump and its optimization using Lagrange theorem H Lin, M Zhang, WC Chan, WK Lee, M Chan 2014 12th IEEE International Conference on Solid-State and Integrated …, 2014 | 3 | 2014 |
| Study of out-of-plane mechanical stress impact on Si BJT and diffusion resistor using in-situ nanoindentation probing Y Liu, G Hiblot, T Furuhashi, H Lin, D Velenis, I De Wolf Microelectronics Reliability 100, 113367, 2019 | 2 | 2019 |
| 23‐4: High‐Slew‐Rate Low‐Static‐Power Dynamic‐Bias Rail‐to‐Rail Output Buffer for OLED‐on‐Silicon VR Microdisplay J Wen, B Liu, T Zhou, H Lin, M Zhang SID Symposium Digest of Technical Papers 49 (1), 295-298, 2018 | 2 | 2018 |
Min ZHANGPeking University Shenzhen Graduate SchoolVerified email at ece.pku.edu.cn
