| CFD modeling of a thermoelectric device for electronics cooling applications N Lakhkar, M Hossain, D Agonafer 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2008 | 11 | 2008 |
| Effect of structural design parameters on Wafer level CSP ball shear strength and their influence on accelerated thermal cycling reliability N Lakhkar, P Viswanadham, D Agonafer ASME International Mechanical Engineering Congress and Exposition 43789, 239-249, 2009 | 6 | 2009 |
| Impact of area contact between sensor bulb and evaporator return line on modular refrigeration unit: Computational and experimental S Karajgikar, N Lakhkar, D Agonafer, R Schmidt J. Heat Transfer 127 (1), 95-100, 2005 | 4 | 2005 |
| Mechanical design optimization of a package on package AR Menon, N Lakhkar, S Karajgikar, D Agonafer International Electronic Packaging Technical Conference and Exhibition 43604 …, 2009 | 3 | 2009 |
| RELIABILITY OF TIN-SILVER-COPPER LEAD-FREE SOLDER INTERCONNECTS UNDER MECHANICAL LOADING WITH DIFFERENT PWB SURFACE FINISHES MM Hossain, F Zahedi, NR Lakhkar, P Viswanadham, SO Dunford, ... Surface Mount Technology Assocation - Interanational, 2008 | 2* | 2008 |
| Characterization of Sn-Ag-Cu solder under tensile and shear loading MM Hossain, T Reinikainen, P Viswanadham, D Agonafer, N Lakhkar SMTA NEWS AND JOURNAL OF SURFACE MOUNT TECHNOLOGY 20 (4), 36, 2007 | 2 | 2007 |
| Characterization of Sn-Ag-Cu solder under tensile and shear loading MM Hossain, T Reinikainen, P Viswanadham, D Agonafer, N Lakhkar SMTA NEWS AND JOURNAL OF SURFACE MOUNT TECHNOLOGY 20 (4), 36, 2007 | 2 | 2007 |
| The Impact of Area Contact Between Sensor Bulb and Evaporator Return Line in a Modular Refrigeration Unit: Part I—Computational Study N Lakhkar, S Karajgikar, D Agonafer, R Schmidt ASME International Mechanical Engineering Congress and Exposition 37149, 651-656, 2003 | 2 | 2003 |
| Electronics enclosure with heat-transfer element NR Lakhkar, KJ Gehret, RM Beisner US Patent 11,206,743, 2021 | 1 | 2021 |
| Solar shroud design using Computational Fluid Dynamics KP Agonafer, N Lakhkar, D Agonafer, A Morrison 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 1 | 2010 |
| Multi-objective optimization of graphite heat spreader for portable systems applications N Lakhkar, A Banerjee, G Refai-Ahmed, D Agonafer International Electronic Packaging Technical Conference and Exhibition 43604 …, 2009 | 1 | 2009 |
| Mechanical Characterization of Sn-Ag-Cu solder with gold addition under tensile loading N Lakhkar, MM Hossain, P Viswanadham, D Agonafer International Electronic Packaging Technical Conference and Exhibition 42770 …, 2007 | 1 | 2007 |
| Development of high performance cold plate tester NR Lakhkar The University of Texas at Arlington, 2005 | 1 | 2005 |
| Design of a Cold Plate Tester for Accurate Measurement of Thermal Performance N Lakhkar, M Iyengar, M Ellsworth Jr, D Agonafer ASME International Mechanical Engineering Congress and Exposition 42177, 531-539, 2005 | 1 | 2005 |
| Magnetic High Voltage Interlock Loop (HVIL) For Variable Frequency Drives In Transport Applications NR Lakhkar, KJ Gehret, DW Cox, RM Beisner US Patent App. 18/377,474, 2024 | | 2024 |
| Magnetic high voltage interlock loop (HVIL) for variable frequency drives in transport applications NR Lakhkar, KJ Gehret, DW Cox, RM Beisner US Patent 11,794,586, 2023 | | 2023 |
| Electronics enclosure with heat-transfer element NR Lakhkar, KJ Gehret, RM Beisner US Patent 11,706,899, 2023 | | 2023 |
| Motor Drive Control Including Varying DC Bus Voltages, Converter and Inverter Switching Frequencies, And Motor Speed For Thermal Mitigation JG Marcinkiewicz, M Qin, NR Lakhkar, R Dziuba US Patent App. 17/453,802, 2023 | | 2023 |
| Thermal Design of Variable Frequency Drives for Hybrid and Electric Transport Applications NR Lakhkar International Electronic Packaging Technical Conference and Exhibition 85505 …, 2021 | | 2021 |
| Investigation of Harmonic Vibration Loading on Package on Package Assemblies N Lakhkar, SO Menon, Michael Electronic System Technology Conference (ESTC), 2013 | | 2013 |
Dereje AgonaferPresidential Distinguished ProfessorEmail verificata su uta.edu
