| Machine tool design and operation strategies for green manufacturing N Diaz, S Choi, M Helu, Y Chen, S Jayanathan, Y Yasui, D Kong, ... | 181 | 2010 |
| Software-based tool path evaluation for environmental sustainability D Kong, S Choi, Y Yasui, S Pavanaskar, D Dornfeld, P Wright Journal of manufacturing systems 30 (4), 241-247, 2011 | 140 | 2011 |
| Copper CMP modeling: millisecond scale adsorption kinetics of BTA in glycine-containing solutions at pH 4 S Choi, S Tripathi, DA Dornfeld, FM Doyle Journal of The Electrochemical Society 157 (12), H1153, 2010 | 33 | 2010 |
| A model of material removal and post process surface topography for copper CMP S Choi, FM Doyle, D Dornfeld Procedia Engineering 19, 73-80, 2011 | 17 | 2011 |
| Material removal mechanism during copper chemical mechanical planarization based on nano-scale material behavior S Choi, FM Doyle, DA Dornfeld ECS Journal of Solid State Science and Technology 6 (5), P235, 2017 | 16 | 2017 |
| Integrated tribo-chemical modeling of copper CMP S Tripathi, S Choi, FM Doyle, DA Dornfeld MRS Online Proceedings Library (OPL) 1157, 1157-E02-03, 2009 | 11 | 2009 |
| Efficiency of a CMP pad at removing protective material from copper during CMP S Choi, FM Doyle, DA Dornfeld ECS Journal of Solid State Science and Technology 6 (4), P187, 2017 | 8 | 2017 |
| Influence of copper ion concentration on the kinetics of formation of a protective layer on copper in an acidic CMP solution containing BTA and glycine S Choi, DA Dornfeld, FM Doyle Journal of The Electrochemical Society 160 (10), H653, 2013 | 6 | 2013 |
| Software support for environmentally benign mold making process and operations D Kong, S Choi, D Dornfeld Re-engineering Manufacturing for Sustainability: Proceedings of the 20th …, 2013 | 5 | 2013 |
| Integrated tribo-chemical modeling of copper CMP S Choi, S Tripathi, FM Doyle, DA Dornfeld Mater. Res. Soc. Symp. Proc. 1157, E02–E03, 2009 | 2 | 2009 |
| Physicochemical Modeling of Copper Chemical Mechanical Planarization (CMP) Considering Synergies in Removal Materials S Choi | 1 | 2013 |
| Jim Evans: A Reflection on his Impact F Doyle Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box …, 2010 | | 2010 |
| Material Removal Mechanism during Copper CMP Based on Nano-Scale Material Behavior S Choi, FM Doyle, D Dornfeld | | |
| MECHANISTIC CMP MODEL PREDICTING POST-CMP TOPOGRAPHY S Choi, A de Closset, FM Doyle, DA Dornfeld | | |
